Hyper SuperServer SYS-222H-TN

CPU: Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores
Core Count: Up to 144C/144T’ Up to 108MB Cache per CPU
Note: Supports up to 330W TDP CPUs (Air Cooled) Supports up to 330W TDP CPUs (Liquid Cooled)​
Max GPU Count: Up to 4 double-width or 8 single-width GPU(s)
Memory: Slot Count: 32 DIMM slots Max Memory (1DPC): Up to 2TB 6400MT/s ECCDDR5 RDIMM Max Memory (2DPC): Up to 2TB 5200MT/s ECCDDR5 RDIMMView Memory Options
NVMe: NVMe’ RAID 0/1/5/10 support(Intel® VROC RAID key required)View NVMe Options
Chipset: System on Chip
Network Connectivity: Via AIOMView AIOM Options View AOC Options
LAN: 1 RJ45 1 GbE Dedicated BMC LAN port(s)
USB: 2 USB 3.0port(s) (rear) 2 USB 3.0port(s) (Header)
Video: 1 VGAport(s)
BIOS Type: AMI 64MB SPI Flash
Software: SuperCloud Composer Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Power configurations: Power-on mode for AC power recovery ACPI Power Management
Hardware: Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features: Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown
CPU: Monitors for CPU Cores, Chipset Voltages, Memory
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 2U Rackmount
Model: CSE-HS219-R000NP
Height: 3.5″ (88 mm)
Width: 17.3″ (438.4 mm)
Depth: 29.73″ (755.2 mm)
Package: 10.12″ (H) x 23.82″ (W) x 37.28″ (D)
Weight: Gross Weight: 66 lbs (30 kg) Net Weight: 40 lbs (18.2 kg)
Available Color: Silver
LED: HDD activity LAN1 activity LAN2 acticity Power Fail Power status System information (overheat/UID) 
Buttons: Power On/Off  UID button
PCI-Express (PCIe) Configuration: Option A*4 PCIe 5.0 x16 FH/10.5″L double-width slot(s) 1 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)1 PCIe 5.0 x8 AIOM slot(s) (OCP 3.0 compatible) Option B*8 PCIe 5.0 x8 (in x16) FH/10.5″L slot(s) 1 PCIe 5.0 x16 AIOM slot(s) (OCP 3.0 compatible)1 PCIe 5.0 x8 AIOM slot(s) (OCP 3.0 compatible) (*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)View AOC Options
CXL Support: Up to 4CXL 2.0 x16/x8devices
Drive Bays Configuration: Default: Total 8 bay(s)8 front hot-swap 2.5″ NVMe*/SAS*/SATA* drive bay(s)Option A: Total 16 bay(s)16 front hot-swap 2.5″ NVMe*/SAS*/SATA* drive bay(s)Option B: Total 24 bay(s)24 front hot-swap 2.5″ NVMe*/SAS*/SATA* drive bay(s)(*NVMe/SAS/SATA support may require additional storage controller and/or cables, please see the optional parts list for details)View NVMe Options View Drive Options
M.2: 2 M.2 PCIe 5.0 x2 NVMe slot(s) (M-key 2280/22110)View M.2 Options
Fans: 4x 8cmheavy duty fans with optimal fan speed control
Air Shroud: 2 Air Shroud(s)
Liquid Cooling: Direct to Chip (D2C) Cold Plate (optional)
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)