CPU: Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Core Count: Up to 56C/112T’ Up to 112.5MB Cache per CPU
Note: Supports up to 350W TDP CPUs (Liquid Cooled)
Max GPU Count: Up to 4 onboardGPU(s)
Supported GPU: NVIDIA SXM: HGX H100 4-GPU (80GB)View GPU Options
CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect: NVIDIA® NVLink®
Memory: Slot Count: 32 DIMM slots/16 Channels Max Memory (2DPC): Up to 8TB 5600MT/s ECCDDR5 RDIMM/LRDIMMView Memory Options
Chipset: Intel®C741
Network Connectivity: 2 RJ45 10GbE with Intel® X710-AT2 View AOC Options
Video: 1 VGAport(s)
BIOS Type: AMI 32MB SPI Flash EEPROM
Software: SuperCloud Composer Supermicro Server Manager (SSM) Supermicro Update Manager (SUM) Supermicro SuperDoctor® 5 (SD5) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Power configurations: Power-on mode for AC power recovery ACPI Power Management
Hardware: Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features: Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown
CPU: Monitors for CPU Cores, Chipset Voltages, Memory 8+4 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 2U Rackmount
Model: CSE-228G2TS-R5K25P
Height: 3.5″ (89 mm)
Width: 17.2″ (437 mm)
Depth: 32.7″ (830.3 mm)
Package: 11″ (H) x 22.5″ (W) x 45.5″ (D)
Weight: Gross Weight: 86.5 lbs (39.2 kg) Net Weight: 67.5 lbs (30.6 kg)
Available Color: Silver Body
LED: Hard drive activity LED Network activity LEDs Power status LED System Overheat & Power Fail LED
Buttons: Power On/Off button System Reset button
PCI-Express (PCIe) Configuration: Default4 PCIe 5.0 x16 LP slot(s) View AOC Options
M.2: 2 M.2 PCIe 5.0 x4 NVMe slot(s) (M-key 22110(default)/2280)
Drive Bays Configuration: Default: Total 4 bay(s)4 front hot-swap 2.5″ NVMe/SATA drive bay(s) View NVMe Options View Drive Options
M.2: View M.2 Options
Fans: 4 Fan 8cm Fan(s)
Liquid Cooling: Direct to Chip (D2C) Cold Plate (optional)
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
Key Applications
- High Performance Computing
- AI/Deep Learning Training
- Industrial Automation, Retail
- Healthcare
- Conversational AI
- Business Intelligence &’ Analytics
- Drug Discovery
- Climate and Weather Modeling
- Finance &’ Economics
Key Features
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- Highest GPU communication using NVIDIA® NVLINK™
- High density 2U system with NVIDIA® HGX™ H100 4-GPU
- 5th/4th Gen Intel® Xeon® Scalable processor support
- 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5
- 4 PCIe Gen 5.0 X16 LP
- Flexible networking options
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- 2 M.2 NVMe for boot drive only
- 4x 2.5″ Hot-swap NVMe/SATA3 drive bays
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- Direct-To-Chip Liquid Cooling solution
- 4 heavy duty fans with optimal fan speed control
- 2x 5250W(1+1) Redundant Power Supplies