X14DBHM

Form Factor: OCP M-FLW
Dimension: 16.66″ x 13.7″ (42.3164cm x 34.798cm)
CPU: Intel® Xeon® 6 Processors Dual Socket E2 (LGA-4710) supported, CPU TDP supports Up to 350W TDP
Core: Up to 144 (E) cores
Memory Capacity: 32 DIMM slots Up to 8TB 3DSECC RDIMM, DDR5-6400MT/s
Memory Type: 6400 MT/s ECC DDR5 RDIMM (3DS)Up to 256GB of memory with speeds of up to 6400 MT/s (1DPC) or 5200MT/s (2DPC)
DIMM Sizes: 16GB, 24GB,32GB, 48GB,64GB, 96GB, 128GB, 256GB RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage: 1.1V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: System on Chip
Network Controllers: N/A
LAN: 2 AIOM
USB: 1 USB 3.2 Gen1 port(s) (1 type A)
TPM: 1 TPM Header 1 TPM TPM 2.0 onboard
PCIe: 2 PCIe 5.0 x16 AIOM Slot, AIOM slots Superset of OCP 3.0 Expansion,4 PCIe 5.0 x16,1 PCIe 5.0 x8 (in x16 slot),8 PCIe 5.0 x8
M.2: M.2 Interface: 2 PCIe 5.0 x4 Form Factor: 2280/22110 Key: M-Key
BIOS Type: AMI
BIOS Features: ACPI 6.5SMBIOS 3.7 or laterUEFI 2.9
Voltage: VBAT, System level control, Supports system management utility, Monitors CPU voltages, +5V standby, +5V, +3.3V, +12V
LED: UID/Remote UID CPU / System Overheat LED
Temperature: Monitoring for CPU and chassis environment CPU thermal trip support Thermal Monitor 2 (TM2) support PECI
FAN: Fan speed control
Other Features: UID M.2 NGFF connector Control of power-on for recovery from AC power loss Chassis intrusion detection ACPI power management