Form Factor: Proprietary WIO
Dimension: 8″ x 13″ (20.32cm x 33.02cm)
CPU: 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Single Socket LGA-4677 (E) supported, CPU TDP supports Up to 350W TDP
Core: Up to 64 cores
Memory Capacity: 8 DIMM slots Up to 2TB 3DSECC RDIMM, DDR5-5600MT/s
Memory Type: 5600/5200/4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS)Up to 256GB of memory with speeds of up to 5600MT/s(1DPC)
DIMM Sizes: 16GB, 24GB,32GB, 48GB,64GB, 96GB, 128GB, 256GB
Memory Voltage: 1.1V
Error Detection: Corrects single-bit errors
Chipset: Intel® C741
SATA: Intel® C741 controller for 10 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2600 BMC
Graphics: 1 Aspeed AST2600 BMC port(s)
Network Controllers: Dual LAN with 10GBase-T with Intel® X550
SATA: 10 SATA3 (6Gbps) port(s)
LAN: 2 RJ45 10 Gigabit Ethernet LAN ports 1 RJ45 Dedicated IPMI LAN port
USB: 5 USB 2.0 port(s) (2 via header’ 2 rear’ 1 Type A) 4 USB 3.2 Gen1 port(s) (2 via header’ 2 rear)
Video Output: 1 VGA D-Sub Connector port(s)
Serial Port: 2 COMPort(s) (1 header’ 1 rear)
DOM: 2 SATA DOM (Disk on Module) power connector support
TPM: 1 TPM Header
PCIe: 1 PCIe 5.0 x8 Right Riser (in x16) slot,1 PCIe 5.0 x32 Left Riser Slot,5 PCIe 5.0 x8 PCIe5.0 MCIO connector
M.2: M.2 Interface: 1 PCIe 3.0 x2 Form Factor: 2280/22110 Key: M-Key
BIOS Type: AMI UEFI
BIOS Features: ACPI 6.4SMBIOS 3.5UEFI 2.8 or above
Voltage: VBAT, System level control, Supports system management utility, Monitors CPU voltages, Chipset Voltage, Chassis intrusion header, 6 -fan status, +5V standby, +5V, +3.3V, +12V, Memory Voltages
LED: UID/Remote UID CPU / System Overheat LED
Temperature: Monitoring for CPU and chassis environment CPU thermal trip support Thermal Monitor 2 (TM2) support PECI
FAN: 6x 4-pin fan headers (up to 6 fans) Fan speed control 6 fans with tachometer status monitoring Overheat LED indication
Other Features: WOL, UID, Node Manager Support, M.2 NGFF connector, Control of power-on for recovery from AC power loss, ACPI power management
Key Features
- 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
- Intel C741® Chipset
- Up to 2TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) in 8 DIMM slots
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- 1 PCIe 5.0 x8 ( in x16)
- 1 PCIe 5.0 x32
- M.2 Interface: 1 PCIe 3.0 x2
- M.2 Form Factor: 2280, 22110
- M.2 Key: M-Key
- 10 NVMe ports PCIe 5.0 x8 via 5 MCIO connectors
- Dual LAN with 10GBase-T with Intel® X550
- 2 SuperDOM with built-in power
- I/O: 1 VGA, 2 COM, 1 TPM header
- 4 USB 3.2 Gen1 (2 rear, 2 via header), 3 USB 2.0 (2 rear, 1 via Type-A)
- Intel® C741 controller for 10 SATA3 (6 Gbps) ports
Optimized Servers
SYS-111E-FDWTR-OS1SYS-111E-FWTR-OS1
Part Number | Qty | Description |
AOM-TPM-9670V | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |