Form Factor: Proprietary
Dimension: 10.11″ x 16.79″ (256.79cm x 426.47cm)
CPU: 4th Gen Intel® Xeon® Scalable processors 8 Socket Socket E (LGA-4677) supported, CPU TDP supports Up to 350W TDP
Core: Up to 64 cores
Memory Capacity: 32 DIMM slots Up to 32TB 3DSECC RDIMM, DDR5-4800MT/s
Memory Type: 4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS)Up to 256GB of memory with speeds of up to 4400MT/s (2DPC)
DIMM Sizes: 16GB, 32GB, 64GB, 128GB, 256GB RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage: 1.1V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: Intel® C741
Network Controllers: N/A
PCIe: N/A
BIOS Type: AMI 64MB AMI UEFI
BIOS Features: ACPI 6.4SMBIOS 2.8/3.5UEFI 2.8APlug and Play (PnP)PCI FW 3.2
Software: Redfish API, Supermicro Server Manager (SSM), Supermicro Power Manager (SPM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), KVM with dedicated LAN , IPMI 2.0
Voltage: PCH temperature, Memory temperature, CPU temperature, Peripheral temperature, Platform Environment Control Interface (PECI)/(TSI), Fan speed control
FAN: 10x 4-pin fan headers (up to 10 fans)
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
X13OEI-CPU
Key Features
- 4th Gen Intel® Xeon® Scalable processors, Dual Sockets LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP (4 CPU module in one 8 Way System)
- Intel C741® Chipset (On PCH Module)
- Up to 8TB 3DS RDIMM/RDIMM DDR5 (288-pin) ECC memory with speeds up to 4800MHs (max.) in 32 DIMMs. Up to 8TB PMem 300 Series Memory
- PCI Slot Located on PCIe Module
- USB &’ Display Port on PCH Module
Optimized Servers
SYS-681E-TR