Form Factor: Proprietary
Dimension: 8.53″ x 12.42″ (21.67cm x 31.55cm)
CPU: 3rd Gen Intel® Xeon® Scalable processors Single Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 270W TDP
Core: Up to 40 cores
Memory Capacity: 16 DIMM slots Up to 2TBIntel® Optane™ Persistent Memory 200 Series Up to 2TB ECC LRDIMM, DDR4-3200MT/s’ Up to 2TB 3DSECC LRDIMM, DDR4-3200MT/s’ Up to 2TB ECC RDIMM, DDR4-3200MT/s’ Up to 2TB 3DSECC RDIMM, DDR4-3200MT/s
Memory Type: 3200/2933/2666 MT/s ECC , DDR4 LRDIMM, RDIMM
DIMM Sizes: 8GB, 16GB, 32GB, 64GB, 128GB, 256GB DCPMM: 64GB, 128GB, 256GB LRDIMM: 64GB, 128GB LRDIMM: 128GB, 256GB RDIMM: 8GB, 16GB, 32GB, 64GB RDIMM: 64GB, 128GB, 256GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errors
Chipset: Intel® C621A
SAS: Broadcom 3808 SAS3 (12 Gbps) controller for 6 SAS3 (6 Gbps) ports
Graphics: 1 ASPEED AST2600 BMC port(s)
Network Controllers: N/A
Serial Port: 1 COMPort(s) (1 header)
TPM: 1 TPM Header
PCIe: N/A
M.2: M.2 Interface: 2 SATA/PCIe 3.0 x4, RAID 0 & 1 Form Factor: 2280 Key: M-Key
BIOS Type: AMI UEFI
Software: Redfish API, Supermicro Server Manager (SSM), Supermicro Power Manager (SPM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), KVM with dedicated LAN , IPMI 2.0
System Management Software: IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
Power Configurations: Power-on mode for AC power recovery, ACPI Power Management
Hardware: Trusted Platform Module (TPM) 2.0
Voltage: VBAT, PCH temperature, Memory temperature, CPU temperature, +5V standby, +5V, +3.3V, +12V, +1.8V, VRM temperature, Memory Voltages, CPU thermal trip support
LED: UID/Remote UID BMC/IPMI Heartbeat LED
Other Features: WOL, UID, RoHS, Node Manager Support, RoT, NCSI header
FAN: 1x 4-pinfan header (up to 1 fan)
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
X12SPT-GC
Key Features
-
- 3rd Gen Intel® Xeon® Scalable processors
- Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP
- Intel® C621A
-
- Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz’ Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
- Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 16 DIMM slots
- 1x PCIe 4.0 x8 4C connector (for front I/O module), 4x PCIe 4.0 x8 MCIO connectors
- LSI 3808 controller for 6 SAS3 ports
- M.2 Interface: 2 PCIe 3.0 x4&’SATA,M.2 Form Factor: 2280
Optimized Servers
SYS-210GT-HNC8F
| Part Number | Qty | Description |
|
AOM-TPM-9670V
AOM-TPM-9671V |
1
1 |
SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor |