Form Factor: ATX
Dimension: 12.23″ x 10″ (31.06cm x 25.4cm)
CPU: 3rd Gen Intel® Xeon® Scalable processors Dual Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 185W TDP, Dual UPI up to 11.2 GT/s
Memory Capacity: 8 DIMM slots Up to 2TB 3DSECC LRDIMM, DDR4-3200MT/s’ Up to 2TB ECC RDIMM, DDR4-3200MT/s
Memory Type: 3200/2933/2666 MT/s ECC DDR4 LRDIMM (3DS), RDIMM
DIMM Sizes: 256GB LRDIMM: 256GB RDIMM: 256GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: Intel® C621A
SATA: Intel® C621A controller for 12 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2600 BMC
Graphics: 1 ASPEED AST2600 BMC port(s)
Network Controllers: Dual LAN with Intel® X550 10GBase-T Ethernet Controller
LAN: 2 RJ45 10 Gigabit Ethernet LAN ports
USB: 5 USB 3.2 Gen1 port(s) (2 via header’ 2 rear’ 1 type A)
Video Output: 1 VGA port(s)
Serial Port: 1 COMPort(s) (1 header)
DOM: 2 SATA DOM (Disk on Module) power connector support
TPM: 1 TPM Header
PCIe: 4 PCIe 4.0 x16
M.2: M.2 Interface: 1 PCIe 4.0 x4′ 1 PCIe 4.0 x4 Form Factor: 2280/22110, 2280 Key: M-Key, M-Key
BIOS Type: AMI UEFI
Software: Redfish API, Supermicro Server Manager (SSM), Supermicro Power Manager (SPM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), KVM with dedicated LAN , IPMI 2.0
System Management Software: IPMICFG, IPMIView for Linux/Windows, SMCIPMITool
Power Configurations: ACPI Power Management
Hardware: Trusted Platform Module (TPM) 2.0
Voltage: Supports system management utility, Monitors CPU voltages, Chassis intrusion header, 3.3V standby, +5V standby, +5V, +3.3V, +12V, 8 -fan status
LED: UID/Remote UID BMC/IPMI Heartbeat LED
Temperature: CPU thermal trip support PECI
FAN: 8x 4-pin fan headers (up to 8 fans) PWM fan speed control Overheat LED indication
Other Features: UID, Node Manager Support, Dual Cooling Zones, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion header, Chassis intrusion detection, ATX Power connector, ACPI power management, RoT, NCSI header
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
Key Features
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- 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 185W TDP, 2 UPI up to 11.2 GT/s
- Intel® C621A
- Up to 2TB RDIMM, DDR4-3200MHz’ Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz, in 8 DIMM slots
-
- 4 PCIe 4.0 x16,
- 1 PCIe 4.0 NVMe x8 Internal Port(s)
- M.2 Interface: 2 PCIe 4.0 x4
- M.2 Form Factor: 2280/22110, 2280
- M.2 Key: M-Key
- Intel® C621A controller for 12 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
- Dual LAN with Intel® X550 10GBase-T Ethernet Controller
- 1 VGA port
Part Number | Qty | Description |
MCP-260-00157-0N | 1 | 1U I/O Shield for X12DPL with EMI Gasket,RoHS |