X12DPi-NT6

Key Features

    • 3rd Gen Intel® Xeon® Scalable processors
    • Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
  1. Intel® C621A
    • Up to 4TB RDIMM, DDR4-3200MHz’ Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
    • Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slotsP1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 series only.
    • 2 PCIe 4.0 x8,
    • 4 PCIe 4.0 x16,
    • 2 PCIe 4.0 NVMe x8 Internal Port(s)
    • M.2 Interface: 1 PCIe 4.0 x4
    • M.2 Form Factor: 2280/22110
    • M.2 Key: M-Key
  2. Intel® C621A controller for 14 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
  3. Dual LAN with 10GBase-T with Intel® X550
  4. 2 VGA (1 rear bezel, 1 front panel) ports

Optimized Servers

SYS-220P-C9RTSYS-620P-TRTSYS-740P-TRTSSG-620P-ACR12HSSG-620P-ACR12LSSG-620P-ACR16HSSG-620P-ACR16LSSG-640P-E1CR24LSSG-640P-E1CR24HSSG-640P-E1CR36LSSG-640P-E1CR36H

Form Factor: E-ATX
Dimension: 12″ x 13″ (30.48cm x 33.02cm)
CPU: 3rd Gen Intel® Xeon® Scalable processors Dual Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Core: Up to 40 cores
Memory Capacity: 18 DIMM slots Up to 4TBIntel® Optane™ Persistent Memory 200 Series, DDR4-3200MT/s Up to 4TB 3DSECC LRDIMM, DDR4-3200MT/s’ Up to 4TB ECC RDIMM, DDR4-3200MT/s P1-DIMMB2 and P2-DIMMB2 are reserved for Intel Optane Persistent Memory 200 Series only.
Memory Type: 3200/2933/2666 MT/s ECC DDR4 LRDIMM (3DS), RDIMM
DIMM Sizes: LRDIMM: 256GB RDIMM: 256GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: Intel® C621A
SATA: Intel® C621A controller for 14 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2600 BMC
Network Controllers: Dual LAN with 10GBase-T with Intel® X550
SATA: 14 SATA3 (6Gbps) port(s)
LAN: 2 RJ45 10 Gigabit Ethernet LAN ports
USB: 2 USB 2.0 port(s) (2 via header) 7 USB 3.2 Gen1 port(s) (2 via header’ 4 rear’ 1 type A)
Video Output: 2 VGA (1 rear bezel, 1 front panel) port(s)
Serial Port: 2 COMPort(s) (1 header’ 1 rear)
TPM: 1 TPM Header
PCIe: 4 PCIe 4.0 x16,2 PCIe 4.0 x8
M.2: M.2 Interface: 1 PCIe 4.0 x4 Form Factor: 2280/22110 Key: M-Key
BIOS Type: AMI UEFI
Software: Redfish API, Supermicro Server Manager (SSM), Supermicro Power Manager (SPM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), KVM with dedicated LAN , IPMI 2.0
System Management Software: IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
Hardware: Trusted Platform Module (TPM) 2.0
Voltage: VBAT, System temperature, PCH temperature, Monitors CPU voltages, Memory temperature, CPU temperature, Chassis intrusion header, 3.3V standby, +5V standby, +5V, +3.3V, +12V, VRM temperature, Memory Voltages, LAN temperature, 8 -fan status
LED: UID/Remote UID Power LED BMC/IPMI Heartbeat LED
FAN: 8x 4-pin fan headers (up to 8 fans) PWM fan speed control
Other Features: WOL, UID, RoHS, Node Manager Support, Dual Cooling Zones, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion header, ATX Power connector, ACPI power management, SDDC, RoT, NCSI header
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)

Part Number Qty Description
AOM-TPM-9670H
AOM-TPM-9670V
AOM-TPM-9671V
AOM-TPM-9671H
1
1
1
1
SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor
SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor

Форма заявки