Form Factor: Proprietary
Dimension: 17.3″ x 13.7″ (43.94cm x 34.8cm)
CPU: 3rd Gen Intel® Xeon® Scalable processors Dual Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Core: Up to 40 cores
Memory Capacity: 32 DIMM slots Up to 8GBIntel® Optane™ Persistent Memory 200 Series, DDR4-3200MT/s Up to 4TB 3DSECC LRDIMM, DDR4-3200MT/s’ Up to 4TB 3DSECC RDIMM, DDR4-3200MT/s
Memory Type: 3200/2933/2666 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: 16GB, 32GB, 64GB, 128GB, 256GB LRDIMM: 16GB, 32GB, 64GB, 128GB, 256GB RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage: 1.2V
Error Detection: Detects double-bit errors (using ECC memory)
Chipset: Intel® C621A
SATA: Intel® C621A controller for 4 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2600 BMC
Network Controllers: N/A
USB: 1 USB 3.2 Gen2 port(s) (1 rear Through riser card)
Video Output: 1 VGA port(s) Through riser card
Serial Port: 1 COMPort(s) (1 rear Through riser card)
TPM: 1 TPM Header
PCIe: 8 PCIe 4.0 x8 SlimSAS
M.2: M.2 Interface: 2 PCIe 3.0 x4 Form Factor: 2280/22110 Key: M-Key
BIOS Type: AMI UEFI
Software: Redfish API, Supermicro Server Manager (SSM), Supermicro Power Manager (SPM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), KVM with dedicated LAN , IPMI 2.0
System Management Software: IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
Power Configurations: ACPI / ACPM Power Management
Hardware: Trusted Platform Module (TPM) 2.0
Voltage: System temperature, PCH temperature, Memory temperature, CPU temperature, Chipset Voltage, 3.3V standby, 1.2V (VDIMM), 1.05 (PCH), +5V standby, +5V, +3.3V, +12V, VRM temperature, LAN temperature, CPU thermal trip support, +1.8V PCH
LED: UID/Remote UID Power LED BMC/IPMI Heartbeat LED
Temperature: Monitoring for CPU and chassis environment CPU thermal trip support
FAN: 4x 4-pin fan headers (up to 4 fans) Fan speed control 6 fans with tachometer status monitoring
Other Features: UID CPU thermal trip support for processor protection Chassis intrusion header Chassis intrusion detection ACPI power management
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
Key Features
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- 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
- Intel® C621A
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- Up to 8TB 3DS ECC RDIMM, DDR4-3200MHz’ Up to 8TB 3DS ECC LRDIMM, DDR4-3200MHz
- Up to 8GB Unbufferred ECC Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 32 DIMM slots
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- 8 PCIe 4.0 x8 SlimSAS ports supporting 4 Nvidia Redstone GPUs
- 8 PCIe 4.0 x8 SlimSAS ports supporting 4 AOC
- M.2 Interface: 2 Hybrid PCIe 4.0 x4 / SATA3
- M.2 Form Factor: 2280/22110
- Flexible networking options
Optimized Servers
SYS-220GQ-TNAR+