Form Factor: Proprietary
Dimension: 9.15″ x 19.8″ (23.24cm x 50.29cm)
CPU: 3rd Gen Intel® Xeon® Scalable processors Dual Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Core: Up to 40 cores
Memory Capacity: 16 DIMM slots Up to 4TBIntel® Optane™ Persistent Memory 200 Series, DDR4-3200MT/s’ Up to 6TBIntel® Optane™ Persistent Memory 200 Series, DDR4-3200MT/s Up to 4TB 3DSECC LRDIMM, DDR4-3200MT/s’ Up to 4TB 3DSECC RDIMM, DDR4-3200MT/s
Memory Type: 3200/2933/2666 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: LRDIMM: 16GB, 32GB, 64GB, 128GB, 256GB RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage: 1.2V
Error Detection: Detects double-bit errors (using ECC memory)
Chipset: Intel® C621A
SATA: Intel® C621A controller for 8 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2600 BMC
Network Controllers: N/A
USB: 2 USB 3.2 Gen2 port(s) (2 rear)
Video Output: 1 VGA port(s)
Serial Port: 1 COMPort(s) (1 rear)
TPM: 1 TPM Header
PCIe: 1 PCIe 4.0 x8 AIOM,2 PCIe 4.0 x8,6 PCIe 4.0 x16
M.2: M.2 Interface: 2 PCIe 3.0 x4 Form Factor: 2280/22110 Key: M-Key M.2 supported through M.2 carrier board
BIOS Type: AMI UEFI
Software: Redfish API, Supermicro Server Manager (SSM), Supermicro Power Manager (SPM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), KVM with dedicated LAN , IPMI 2.0
System Management Software: IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
Power Configurations: ACPI / ACPM Power Management
Hardware: Trusted Platform Module (TPM) 2.0
Voltage: VBAT, PCH temperature, Memory temperature, Memory, CPU temperature, CPU, Chipset Voltage, Chassis intrusion header, 1.2V (VDIMM), +5V standby, +5V, +3.3V, +12V, VRM temperature, Memory Voltages, CPU thermal trip support, +1.0V PCH, 8x fans with tachometer monitoring
LED: UID/Remote UID Power LED BMC/IPMI Heartbeat LED
Temperature: Monitoring for CPU and chassis environment CPU thermal trip support
FAN: Fan speed control 8x fans with tachometer monitoring
Other Features: UID CPU thermal trip support for processor protection Chassis intrusion header Chassis intrusion detection ACPI power management
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
Key Features
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- 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
- Intel® C621A
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- Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz’ Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
- Up to 4GB Unbufferred ECC Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 16 DIMM slots
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- 6 PCIe 4.0 x16
- 2 PCIe 4.0 x8
- M.2 Interface: 2 PCIe 4.0 x4
- M.2 Form Factor: 2280/22110
- Flexible networking options
- 1 VGA port
Optimized Servers
SYS-220GP-TNR