Form Factor: Proprietary FatTwin
Dimension: 8.53″ x 19.66″ (21.59cm x 48.26cm)
CPU: 3rd Gen Intel® Xeon® Scalable processors Dual Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 165W TDP, 3 UPI up to 10.4 GT/s
Memory Capacity: 16 DIMM slots Up to 4TBIntel® Optane™ Persistent Memory 200 Series, DDR4-3200MT/s Up to 2TB 3DSECC LRDIMM, DDR4-3200MT/s’ Up to 2TB 3DSECC RDIMM, DDR4-3200MT/s
Memory Type: ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: 32GB, 64GB, 128GB LRDIMM: 32GB, 64GB, 128GB RDIMM: 32GB, 64GB, 128GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: Intel® C621A
SATA: Intel® C621A controller for 10 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2600 BMC
Graphics: 1 ASPEED AST2600 BMC port(s)
Network Controllers: Single LAN, Networking options provided via AIOM module
SATA: 10 SATA3 (6Gbps) port(s)
LAN: 1 RJ45 Dedicated IPMI LAN port
USB: 2 USB 3.2 Gen1 port(s) (2 rear)
Video Output: 1 VGA port(s)
Serial Port: 1 COMPort(s) (1 header)
DOM: 2 SATA DOM (Disk on Module) power connector support
TPM: 1 TPM Header
PCIe: 1 PCIe 4.0 x16 Right Riser Slot,1 PCIe 4.0 x8 connector for SMC add-on cards,1 PCIe 4.0 x16 AIOM, OCP 3.0 compliant
BIOS Type: AMI UEFI
Software: Redfish API, Supermicro Server Manager (SSM), Supermicro Power Manager (SPM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), KVM with dedicated LAN , IPMI 2.0
Power Configurations: ACPI Power Management
Hardware: Trusted Platform Module (TPM) 2.0
Voltage: Monitors CPU voltages, Chipset Voltage, 1.05 (PCH), +5V standby, +5V, +3.3V, +12V, +1.8V
LED: UID/Remote UID BMC/IPMI Heartbeat LED
Temperature: Thermal Control for 3 Fan Connectors Monitoring for CPU and chassis environment CPU thermal trip support
FAN: 3x 4-pin fan headers (up to 3 fans) PWM fan speed control
Other Features: WOL, UID, RoHS, Node Manager Support, CPU thermal trip support for processor protection, SDDC
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
Key Features
-
- 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 165W TDP, 3 UPI up to 10.4 GT/s
- Intel® C621A
-
- Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz’ Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz
- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 16 DIMM slots
-
- 1 PCIe 4.0 x16 Right Riser Slot,
- 1 PCIe 4.0 x8 connector for SMC add-on cards,
- 3 PCIe 4.0 NVMe x8 Internal Port(s)
- 1 PCIe 4.0 x16, OCP 3.0 compliant
- Intel® C621A controller for 10 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
- 1 VGA port
-
- Single LAN with
- Networking options provided via AIOM module
Optimized Servers
SYS-F610P2-RTNSYS-F620P3-RTBN
Part Number | Qty | Description |
AOM-TPM-9670H
AOM-TPM-9670V |
1
1 |
SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |