Form Factor: E-ATX
Dimension: 12″ x 13″ (30.48cm x 33.02cm)
CPU: 3rd Gen Intel® Xeon® Scalable processors Dual Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Memory Capacity: 16 DIMM slots Up to 4TBIntel® Optane™ Persistent Memory 200 Series, DDR4-3200MT/s Up to 4TB 3DSECC LRDIMM, DDR4-3200MT/s’ Up to 4TB 3DSECC RDIMM, DDR4-3200MT/s
Memory Type: 3200/2933/2666 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: 8GB, 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: Intel® C621A
SATA: Intel® C621A controller for 8 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2600 BMC
Audio: 7.1 HD Audio
Graphics: 1 ASPEED AST2600 BMC port(s)
Network Controllers: Dual LAN with Intel® i210 Gigabit Ethernet Controller
USB: 6 USB 3.2 Gen1 port(s) (2 via header’ 4 rear) 2 USB 3.2 Gen2 port(s) (1 via header’ 1 rear type A)
Video Output: 1 VGA D-Sub Connector port(s)
Serial Port: 1 COMPort(s) (1 header)
DOM: 2 SuperDOM (Disk on Module) power connector
TPM: 1 TPM Header
PCIe: 1 PCIe 4.0 x8,5 PCIe 4.0 x16
M.2: M.2 Interface: 2 PCIe 4.0 x4, RAID 0 & 1 Form Factor: 2280/22110 Key: M-Key
BIOS Type: AMI UEFI
Software: Redfish API, Supermicro Server Manager (SSM), Supermicro Power Manager (SPM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), KVM with dedicated LAN , IPMI 2.0
Hardware: Trusted Platform Module (TPM) 2.0
Voltage: VBAT, System temperature, PCH temperature, Monitors CPU voltages, Memory temperature, CPU temperature, CPU, +5V standby, +5V, +3.3V, +12V, VRM temperature, Memory Voltages, 8 -fan status
LED: Power LED BMC/IPMI Heartbeat LED CPU / System Overheat LED
Temperature: Monitoring for CPU and chassis environment CPU thermal trip support
FAN: 8x 4-pin fan headers (up to 8 fans) PWM fan speed control Status monitoring for speed control 8x fans with tachometer monitoring
Other Features: WOL, UID, RoHS, Node Manager Support, CPU thermal trip support for processor protection, Chassis intrusion header, Chassis intrusion detection, ATX Power connector, ACPI power management, RoT, NCSI Header (OEM Only)
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
Key Features
-
- 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
- Intel® C621A
-
- Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz’ Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz
- Up to 4TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 16 DIMM slots’
-
- 5 PCIe 4.0 x16,
- 1 PCIe 4.0 x8,
- 4 PCIe 4.0 NVMe x4 Internal Port(s)
- M.2 Interface: 2 PCIe 4.0 x4, RAID 0 &’ 1
- M.2 Form Factor: 2280/22110
- M.2 Key: M-Key
- Intel® C621A controller for 8 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
- Dual LAN with Intel® i210 Gigabit Ethernet Controller
- 1 VGA D-Sub Connector port
Optimized Servers
SYS-740A-TSYS-730A-I
Part Number | Qty | Description |
AOM-TPM-9670H
AOM-TPM-9670V |
1
1 |
SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |
CBL-SAST-0953-1 | 2 | Slimline x8 to PCIe 2x SFF-8639 &' Power |