Form Factor: microATX
Dimension: 9.6″ x 9.6″ (24.38cm x 24.38cm)
CPU: 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Single Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 165W TDP
Core: Up to 28 cores
Memory Capacity: 6 DIMM slots Up to 1.5TB 3DSECC LRDIMM, DDR4-2933MT/s’ Up to 1.5TB 3DSECC RDIMM, DDR4-2933MT/s
Memory Type: 2933/2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: LRDIMM: 32GB, 64GB, 128GB RDIMM: 8GB, 16GB, 32GB, 64GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errors
Chipset: Intel® C622
SATA: Intel® C622 controller for 12 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2500
Graphics: 1 ASPEED AST2500 BMC port(s)
Network Controllers: Dual LAN with 10GBase-T with Intel® X722 + X557
SATA: 12 SATA3 (6Gbps) port(s)
LAN: 2 RJ45 10GBase-T ports
USB: 6 USB 2.0 port(s) (4 via header’ 2 rear) 2 USB 3.0 port(s) (2 rear) 3 USB 3 port(s) (2 via header’ 1 type A)
Video Output: 1 VGA port(s)
Serial Port: 2 COMPort(s) (1 header’ 1 rear)
DOM: 2 SATA DOM (Disk on Module) power connector support
TPM: 1 TPM Header
PCIe: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8
M.2: M.2 Interface: PCIe 3.0 x4 Form Factor: 2280, 2242 Key: M-Key
BIOS Type: AMI UEFI
BIOS Features: ACPI 6.0 RTC (Real Time Clock) Wakeup SMBIOS 3.0 or later
Software: SuperDoctor® 5, NMI, SUM, KVM with dedicated LAN, SPM, Intel® Node Manager, IPMI2.0, Watchdog
Power Configurations: Power-on mode for AC power recovery, ACPI Power Management
Voltage: VBAT, Supports system management utility, Monitors CPU voltages, Chassis intrusion header, 3.3V standby, +5V standby, +5V, +3.3V, +12V, +1.8V, 8 -fan status
LED: UID/Remote UID Suspend static indicator LED CPU / System Overheat LED
Temperature: CPU thermal trip support PECI
FAN: 8x 4-pin fan headers (up to 8 fans) System level control PWM fan speed control Fan speed control Overheat LED indication
Other Features: WOL, UID, RoHS, M.2 NGFF connector, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, ACPI power management
Operating Temperature Range: 0°C — 60°C (32°F — 140°F)
Non-Operating Temperature Range: -20°C — 60°C (-4°F — 140°F)
Operating Relative Humidity Range: 10% — 85% (non-condensing)
Non Operating Relative Humidity Range: 10% — 95% (non-condensing)
Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP
- Intel® C622 chipset
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- Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz’ Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots’
- Up to 1TB Intel Optane DC Persistent Memory in memory mode (Cascade Lake Only)
- Expansion slots: 2 PCIe 3.0 x16, 1 PCIe 3.0 x8 (in x8)
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- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4
- Form Factor: 2242, 2280
- Key: M-Key
- 2 10GbE LAN ports
- 12 SATA3 (6Gbps) via C622
- Supports 12V DC power input
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
- I/O: 1 VGA, 2 COM, TPM header
Part Number | Qty | Description |
MCP-260-00114-0N | -- | 1U I/O Shield for X11SPM-TF with EMI Gasket |
AOM-TPM-9670V
AOM-TPM-9671V |
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SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor |