Form Factor: ATX
Dimension: 12″ x 9.6″ (30.48cm x 24.38cm)
CPU: 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Single Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 205W TDP
Core: Up to 28 cores
Memory Capacity: 8 DIMM slots Up to 2TB 3DSECC LRDIMM, DDR4-2933MT/s’ Up to 2TB 3DSECC RDIMM, DDR4-2933MT/s
Memory Type: 2933/2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: LRDIMM: 32GB, 64GB, 128GB RDIMM: 8GB, 16GB, 32GB, 64GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errors
Chipset: Intel® C622
SATA: Broadcom® 3008 SW controller for 8 SAS3 (12 Gbps) ports’ RAID 0,1,10 Intel® C622 controller for 10 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2500
Graphics: 1 ASPEED AST2500 BMC port(s)
Network Controllers: Dual LAN with 10G SFP+ with Intel® X722 + Inphi CS4227
SATA: 10 SATA3 (6Gbps) port(s)
SAS: 8 SAS port(s)
LAN: 2 10G SFP+ LAN ports
USB: 8 USB 2.0 port(s) (2 rear’ 6 via header) 2 USB 3.0 port(s) (2 rear) 3 USB 3 port(s) (2 via header’ 1 type A)
Video Output: 1 VGA port(s)
Serial Port: 2 COMPort(s) (1 header’ 1 rear)
DOM: 2 SATA DOM (Disk on Module) power connector support
TPM: 1 TPM Header
PCIe: 1 PCIe 3.0 x16 (x16 or x8 ), 1 PCIe 3.0 x8 (x0 or x8 ), 1 PCIe 3.0 x8, 1 PCIe 3.0 x4 (in x8 slot)
M.2: M.2 Interface: PCIe 3.0 x4′ SATA Form Factor: 2280 Key: M-Key
BIOS Type: AMI UEFI
BIOS Features: ACPI 6.0 RTC (Real Time Clock) Wakeup SMBIOS 3.0 or later
Software: SuperDoctor® 5, NMI, SUM, KVM with dedicated LAN, SPM, Intel® Node Manager, IPMI2.0, Watchdog
Power Configurations: Power-on mode for AC power recovery, ACPI Power Management
Voltage: VBAT, Supports system management utility, Monitors CPU voltages, Chassis intrusion header, 3.3V standby, +5V standby, +5V, +3.3V, +12V, +1.8V, 8 -fan status
LED: UID/Remote UID Suspend static indicator LED CPU / System Overheat LED
Temperature: CPU thermal trip support PECI
FAN: 8x 4-pin fan headers (up to 8 fans) System level control PWM fan speed control Dual Cooling Zone Overheat LED indication
Other Features: WOL UID RoHS Control of power-on for recovery from AC power loss ACPI power management
Operating Temperature Range: 0°C — 50°C (32°F — 122°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
X11SPH-nCTPF
Key Features
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, Single Socket LGA-3647 (Socket P) supported, CPU TDP supports Up to 205W TDP
- Intel® C622 chipset
- Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz’ Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
-
- Expansion slots:
- 1 PCIe 3.0 x16 (x16 || x8),
- 1 PCIe 3.0 x8 (x0 || x8),
- 1 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8)
- 2x Port NVMe PCIe 3.0 x4 via OCuLink
-
- M.2 NGFF connector
- M.2 Interface: PCIe 3.0 x4 and SATA
- Form Factor: 2280
- Key: M-Key
- 8 SAS3 (12Gbps) via Broadcom® 3008′ RAID 0, 1, 10
- 10 SATA3 (6Gbps) via C622
- 2 10G SFP+
- 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 8 USB 2.0 (2 rear, 6 via headers)
| Part Number | Qty | Description |
| MCP-260-00114-0N | 1 | 1U I/O Shield for X11SPH-nCTPF with EMI Gasket |
|
AOM-TPM-9670V
AOM-TPM-9671V AOM-TPM-9670H AOM-TPM-9671H |
1
1 1 1 |
SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor |