Form Factor: COM-HPC
Dimension: 6.3″ x 6.3″ (16cm x 16cm)
CPU: Intel® Xeon® Processor D-2183IT
Core: Up to 16 cores, 32 threads / 22MB Cache
Memory Capacity: 4 DIMM slots Up to 512GB ECC LRDIMM, DDR4-2400MT/s’ Up to 256GB ECC RDIMM, DDR4-2400MT/s
Memory Type: ECC DDR4 LRDIMM, RDIMM2400
DIMM Sizes: LRDIMM: 16GB, 32GB, 64GB, 128GB RDIMM: 4GB, 8GB, 16GB, 32GB, 64GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: System on Chip
Network Controllers: Quad LAN with 10GBase-KR ports (SoC) to Carrier Board Single LAN with 1GBase-T port (Intel® i210-IT) to Carrier Board
TPM: 1 TPM Header
PCIe: Up to 44 PCIe Gen3 lanes (x16, x8, x4, x1) to Carrier Board
BIOS Type: AMI UEFI
BIOS Features: ACPI 6.2 UEFI 2.7 SMBIOS 2.8 SMBIOS 3.1 PCI FW 3.2 Plug and Play (PnP)
Operating Temperature Range: 0°C — 60°C (32°F — 140°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
Key Features
- Intel® Xeon® Processor D-2183IT, 16-Core, 32 Threads, 100W
- Up to 256GB Registered ECC RDIMM or 512GB ECC LRDIMM, DDR4-2400MHz in 4 DIMM slots
- Up to 44 PCIe Gen3 lanes (x16, x8, x4, x1) to Carrier Board
- Quad 10G BASE-KR ports (SoC) to Carrier Board
- Single 1G BASE-T port (Intel i210IT) to Carrier Board
- System on Chip
Part Number | Qty | Description |
AOM-COMH-TEST | 1 | Embedded Xeon-D COM-HPC Carrier |