Form Factor: Proprietary
Dimension: 15.12″ x 13.2″ (38.4cm x 33.53cm)
CPU: 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Dual Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 205W TDP, 3 UPI up to 10.4 GT/s
Core: Up to 28 cores
Note: BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
Memory Capacity: 16 DIMM slots Up to 2TBIntel® Optane™ Persistent Memory 100 Series, DDR4-2666MT/s Up to 4TB 3DSECC LRDIMM, DDR4-2933MT/s’ Up to 4TB 3DSECC RDIMM, DDR4-2933MT/s Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
Memory Type: 2933/2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: 64GB LRDIMM: 64GB, 128GB RDIMM: 64GB, 128GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: Intel® C621
SATA: Intel® C621 controller for 10 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2500
Graphics: 1 ASPEED AST2500 BMC port(s)
Network Controllers: Dual LAN with Intel® X550 10GBase-T Ethernet Controller
SATA: 10 SATA3 (6Gbps) port(s)
LAN: 2 RJ45 10GBase-T ports
USB: 4 USB 2.0 port(s) (2 via header’ 2 rear) 3 USB 3.2 Gen1 port(s) (2 via header’ 1 type A) 2 USB 3.0 port(s) (2 rear)
Video Output: 1 VGA D-Sub Connector port(s)
Serial Port: 2 COMPort(s) (1 header’ 1 rear)
DOM: 2 SuperDOM (Disk on Module) port with build power
TPM: 1 TPM Header
PCIe: 2 PCIe 3.0 x16, 8 PCIe 3.0 x8, 1 PCIe 3.0 x4 (in x8 slot) Or 4 PCIe 3.0 x16 and 4 PCIe 3.0 x8 and 1 PCIe 3.0 x4 (in x8 slot)
M.2: M.2 Interface: 1 PCIe 3.0 x4 Form Factor: 2280, 22110 Key: M-Key
BIOS Type: 32MB AMI SPI Flash ROM
BIOS Features: Plug and Play (PnP) ACPI 1.0 / 2.0 / 3.0 / 4.0 USB Keyboard support SMBIOS 2.7.1 UEFI 2.3.1
Software: SuperDoctor® 5, NMI, SUM, KVM with dedicated LAN, SPM, Intel® Node Manager, SSM, Watchdog, IPMI (Intelligent Platform Management Interface) v2.0 with KVM support
Power Configurations: ACPI Power Management
Voltage: VBAT, Supports system management utility, HT, Chassis intrusion header, +5V standby, +5V, +3.3V, +12V, +1.8V, 5+1 Phase-switching voltage regulator, 10 -fan status
LED: UID/Remote UID Suspend static indicator LED CPU / System Overheat LED
Other Features: RoHS Node Manager Support CPU thermal trip support for processor protection Chassis intrusion detection
FAN: 10x 4-pin fan headers (up to 10 fans)
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
Key Features
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- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
- Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
- Intel® C621
-
- Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz’ Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz
- Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots’
- Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
-
- 2 PCIe 3.0 x16,
- 8 PCIe 3.0 x8,
- 1 PCIe 3.0 x4 (in x8 slot) Or 4 PCIe 3.0 x16 and 4 PCIe 3.0 x8 and 1 PCIe 3.0 x4 (in x8 slot)
- M.2 Interface: 1 PCIe 3.0 x4
- M.2 Form Factor: 2280, 22110
- M.2 Key: M-Key
- Dual LAN with Intel® X550 10GBase-T Ethernet Controller
- Intel® C621 controller for 10 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
- 1 VGA D-Sub Connector port
Optimized Servers
SYS-2029P-TXRTSYS-6039P-TXRT