Form Factor: Proprietary
Dimension: 13.5″ x 16.73″ (34.29cm x 42.49cm)
CPU: 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Dual Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 205W TDP, 3 UPI up to 10.4 GT/s
Note: *2933 MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
Memory Capacity: 24 DIMM slots Up to 6TB 3DSECC LRDIMM, DDR4-2933MT/s’ Up to 6TB 3DSECC RDIMM, DDR4-2933MT/s Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
Memory Type: 2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: LRDIMM: 64GB, 128GB RDIMM: 32GB, 64GB, 128GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: Intel® C627
IPMI: ASPEED AST2500
Graphics: 0 ASPEED AST2500 BMC port(s)
Network Controllers: Dual LAN with 10GBase-T with Intel® X550
LAN: 2 RJ45 10GBase-T ports
USB: 2 USB 3.0 port(s) (2 rear)
Video Output: 1 VGA D-Sub Connector port(s)
Serial Port: 2 COMPort(s) (1 header’ 1 rear)
DOM: 2 SuperDOM (Disk on Module) port with build power
TPM: 1 TPM Header
PCIe: 2 PCIe 3.0 x16 (Low Profile), 4 PCIe 3.0 x16
M.2: M.2 Interface: 2 PCIe 3.0 x2 Form Factor: 2260/2280/22110 Key: M-Key *2 SATA Hybrid ports, RAID 0 & 1
BIOS Type: AMI UEFI
Software: SuperDoctor® 5, NMI, SUM, KVM with dedicated LAN, SPM, Intel® Node Manager, SSM, IPMI2.0, Watchdog, IPMI (Intelligent Platform Management Interface) v2.0 with KVM support
System Management Software: IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
Power Configurations: ACPI Power Management
Voltage: VBAT, Monitors CPU voltages, Chipset Voltage, +5V standby, +5V, +3.3V, +12V, +1.8V, Memory Voltages
LED: UID/Remote UID CPU / System Overheat LED
Temperature: Monitoring for CPU and chassis environment
FAN: 8x 4-pin fan headers (up to 8 fans) System level control PWM fan speed control Status monitoring for speed control 8x fans with tachometer monitoring
Other Features: WOL, UID, System level control, RoHS, Node Manager Support, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion header, Chassis intrusion detection, RoHS, Halogen Free, Intel® QuickAssist Technology, Innovation Engine
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -30°C — 60°C (-22°F — 140°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
Key Features
-
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors
- Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
- Intel® C627
-
- Up to 6TB 3DS ECC RDIMM, DDR4-2933MHz’ Up to 6TB 3DS ECC LRDIMM, DDR4-2933MHz, in 24 DIMM slots’
- Up to 6TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)
-
- 2 PCIe 3.0 x16 (Low Profile),
- 4 PCIe 3.0 x16
- M.2 Interface: 2 PCIe 3.0 x2
- M.2 Form Factor: 2260/2280/22110
- M.2 Key: M-Key
- *2 SATA Hybrid ports, RAID 0 &’ 1
- Dual LAN with 10GBase-T with Intel® X550
- 1 VGA D-Sub Connector port
Optimized Servers
SSG-1029P-NEL32RSYS-1029P-N32R
Part Number | Qty | Description |
AOM-TPM-9670V | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |