Form Factor: E-ATX
Dimension: 12″ x 13″ (30.48cm x 33.02cm)
CPU: 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Dual Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 205W TDP, 3 UPI up to 10.4 GT/s
Memory Capacity: 16 DIMM slots Up to 2TBIntel® Optane™ Persistent Memory 100 Series, DDR4-2666MT/s Up to 4TB 3DSECC LRDIMM, DDR4-2933MT/s’ Up to 4TB 3DSECC RDIMM, DDR4-2933MT/s
Memory Type: 2933/2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: LRDIMM: 64GB RDIMM: 64GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: Intel® C621
SATA: Intel® C621 controller for 10 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2500
Network Controllers: Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512
SATA: 10 SATA3 (6Gbps) port(s)
LAN: 2 1GbE LAN ports
USB: 7 USB 3.2 Gen1 port(s) (2 via header’ 4 rear’ 1 type A)
Video Output: 1 VGA port(s)
Serial Port: 1 COMPort(s) (1 rear)
DOM: 2 SATA DOM (Disk on Module) power connector support
TPM: 1 TPM Header
PCIe: 3 PCIe 3.0 x16, 4 PCIe 3.0 x8
M.2: M.2 Interface: 2 PCIe 3.0 x4, RAID 0,1 Form Factor: 2242/2260/2280/22110 Key: M-Key
BIOS Type: AMI UEFI
Software: SuperDoctor® 5, SUM, KVM with dedicated LAN, SPM, Intel® Node Manager, SSM, IPMI2.0, Watchdog
Voltage: Monitors CPU voltages, Chipset Voltage, 1.05 (PCH), +5V standby, +5V, +3.3V, +12V, +1.8V, Memory Voltages
LED: UID/Remote UID Power LED BMC/IPMI Heartbeat LED
Temperature: Monitoring for CPU and chassis environment CPU thermal trip support Thermal Control for 8 Fan Connectors
FAN: 8x 4-pin fan headers (up to 8 fans) PWM fan speed control
Other Features: WOL, UID, RoHS, CPU thermal trip support for processor protection, Chassis intrusion header, Chassis intrusion detection, ATX Power connector, ACPI power management, 8-pin 12v DC power connector, SDDC, NCSI header
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
X11DPH-i
Key Features
-
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
- Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 3 UPI up to 10.4 GT/s
- Intel® C621
-
- Up to 4TB 3DS ECC RDIMM, DDR4-2933MHz’ Up to 4TB 3DS ECC LRDIMM, DDR4-2933MHz
- Or 2TB DCPMM, DDR4-2666MHz, in 16 DIMM slots’
- Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only)’
-
- 3 PCIe 3.0 x16,
- 4 PCIe 3.0 x8
- M.2 Interface: 2 PCIe 3.0 x4
- M.2 Form Factor: 2242/2260/2280/22110
- M.2 Key: M-Key (RAID 0,1 support)
- Intel® C621 controller for 10 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
- Dual LAN with 1GbE with Intel® X722 + Marvell 88E1512
- 1 VGA port
| Part Number | Qty | Description |
|
AOM-TPM-9670H
AOM-TPM-9670V AOM-TPM-9671V AOM-TPM-9671H |
1
1 1 1 |
SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor |