Form Factor: Proprietary FatTwin
Dimension: 8.441″ x 18.724″ (21.44cm x 47.56cm)
CPU: 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Dual Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 165W TDP, Dual UPI up to 10.4 GT/s
Core: Up to 28 cores
Note: ** Motherboard supports this maximum TDP. Please verify your system can thermally support. BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SPBIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
Memory Capacity: 12 DIMM slots Up to 2TBIntel® Optane™ Persistent Memory 100 Series, DDR4-2666MT/s Up to 3TB 3DSECC LRDIMM, DDR4-2933MT/s’ Up to 3TB 3DSECC RDIMM, DDR4-2933MT/s
Memory Type: 2933/2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: LRDIMM: 64GB RDIMM: 64GB
Memory Voltage: 1.2V
Error Detection: Detects double-bit errors (using ECC memory)
Chipset: Intel® C621
SATA: Intel® C621 controller forSATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2500
Network Controllers: Single LAN, Networking options provided via SIOM module
SATA: 12 SATA3 (6Gbps) port(s)
SAS: 12 SAS port(s)
LAN: 1 RJ45 Dedicated IPMI LAN port
USB: 2 USB 3.0 port(s) (2 rear)
Video Output: 1 VGA port(s)
PCIe: 1 PCIe 3.0 x16 Left Riser Slot, 1 PCIe 3.0 x16 Right Riser Slot
M.2: M.2 Interface: 2 SATA/PCIe 3.0 x4, RAID 0 & 1 Form Factor: 2242/2260/2280/22110
BIOS Type: AMI UEFI
Software: SUM, KVM with dedicated LAN, SPM, Intel® Node Manager, SSM, Watchdog, IPMI (Intelligent Platform Management Interface) v2.0 with KVM support
Power Configurations: ACPI Power Management
Voltage: VBAT, Monitors CPU voltages, Chipset Voltage, 1.05 (PCH), +5V standby, +5V, +3.3V, +12V, +1.8V, Memory Voltages
LED: BMC/IPMI Heartbeat LED CPU / System Overheat LED
Temperature: Monitoring for CPU and chassis environment CPU thermal trip support
FAN: 4x 4-pin fan headers (up to 4 fans) PWM fan speed control
Other Features: WOL, UID, RoHS, Node Manager Support, CPU thermal trip support for processor protection, Chassis intrusion detection, SDDC, RoT
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
X11DPFF-SNR
Key Features
-
- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
- Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 165W TDP, 2 UPI up to 10.4 GT/s
- Intel® C621
-
- Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz’ Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz
- Or 2TB DCPMM, DDR4-2666MHz, in 12 DIMM slots
-
- 1 PCIe 3.0 x16 Left Riser Slot,
- 1 PCIe 3.0 x16 Right Riser Slot
- M.2 Interface: 2 SATA/PCIe 3.0 x4, RAID 0 &’ 1
- M.2 Form Factor: 2242/2260/2280/22110
- U.2 Interface: 4 PCIe 3.0 x4,
- 4 PCIe 3.0 NVMe x4 Internal Port(s)
- Intel® C621 controller for SATA3 (6 Gbps) ports’ RAID 0,1,5,10
- 1 VGA port
-
- Single LAN with
- Networking options provided via SIOM module
Optimized Servers
SYS-F619P2-FT+
| Part Number | Qty | Description |
|
AOM-TPM-9670H
AOM-TPM-9670V AOM-TPM-9671V AOM-TPM-9671H |
1
1 1 1 |
SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor SPI capable TPM 1.2 with Infineon 9670 controller with horizontal form factor |