Form Factor: Proprietary WIO
Dimension: 12.3″ x 13.4″ (31.24cm x 34.04cm)
CPU: 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Dual Socket Socket P (LGA-3647) supported, CPU TDP supports Up to 205W TDP, Dual UPI up to 10.4 GT/s
Note: BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
Memory Capacity: 12 DIMM slots Up to 3TB 3DSECC LRDIMM, DDR4-2933MT/s’ Up to 3TB 3DSECC RDIMM, DDR4-2933MT/s Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
Memory Type: 2933/2666/2400/2133 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: LRDIMM: 64GB, 128GB RDIMM: 64GB, 128GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: Intel® C622
SATA: Intel® C622 controller for 14 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2500
Graphics: 1 ASPEED AST2500 BMC port(s)
Network Controllers: Dual LAN with 10Gbase-T, from C622
LAN: 2 RJ45 10GBase-T ports
USB: 6 USB 3.2 Gen1 port(s) (2 via header’ 4 rear)
Video Output: 1 VGA port(s)
DOM: 2 SuperDOM (Disk on Module) ports
TPM: 1 TPM Header
PCIe: 1 PCIe 3.0 x32 Left Riser Slot, 1 PCIe 3.0 x16 Right Riser Slot, 1 PCIe 3.0 x16 for Add-On-Module (AOM)
M.2: M.2 Interface: PCIe 3.0 x4 Form Factor: 22110, 2280, 2242, 2260 Key: M-Key
BIOS Type: 256MB UEFI
Software: SuperDoctor® 5, SUM, KVM with dedicated LAN, SPM, Intel® Node Manager, SSM, IPMI2.0, Watchdog
Voltage: Monitors CPU voltages, +5V standby, +5V, +3.3V, +12V, +1.8V, Memory Voltages
LED: UID/Remote UID Power LED BMC/IPMI Heartbeat LED CPU / System Overheat LED
Temperature: Monitoring for CPU and chassis environment CPU thermal trip support
FAN: 6x 4-pin fan headers (up to 6 fans) PWM fan speed control 6 fans with tachometer status monitoring Status monitoring for speed control
Other Features: UID, RoHS, Node Manager Support, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion detection
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
X11DDW-NT
Key Features
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- 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors,
- Dual Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP, 2 UPI up to 10.4 GT/s
- Intel® C622
-
- Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz’ Up to 3TB 3DS ECC LRDIMM, DDR4-2933MHz, in 12 DIMM slots’
- Up to 2TB Intel® Optane™ DC Persistent Memory in memory mode (Cascade Lake only).
-
- 1 PCIe 3.0 x32 Left Riser Slot,
- 1 PCIe 3.0 x16 Right Riser Slot,
- 1 PCIe 3.0 x16 for Add-On-Module (AOM)
- M.2 Interface: PCIe 3.0 x4
- M.2 Form Factor: 2242, 2260, 2280, 22110
- M.2 Key: M-Key
- U.2 Interface: PCIe 3.0 x4,
- 4 PCIe 3.0 NVMe x4 Internal Port(s)
- Intel® C622 controller for 14 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
-
- Dual LAN with 10Gbase-T
- from C622
- 1 VGA port
Optimized Servers
SSG-6019P-ACR12L+SYS-1029P-WTRTSYS-6029P-WTRT
| Part Number | Qty | Description |
|
AOM-TPM-9670V-S AOM-TPM-9671V-S |
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SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor
SPI capable TPM 1.2 with Infineon 9670 controller with vertical form factor |