X10OBI-CPU

MBD-X10OBI-CPU: X10OBI-CPU
Form Factor: Proprietary
Dimensions: 11.07″ x 20.17″ (28.12cm x 51.23cm)
CPU: Intel® Xeon® processor E7-8800 v3, Intel® Xeon® processor E7-8800 v4.Octal Socket LGA-2011 (Socket R) supported, CPU TDP support Up to 165W TDP, 3 QPI up to 9.6GT/s
Memory Capacity: Up to 3TB 3DS ECC RDIMM, DDR4-1866MHz’ Up to 3TB 3DS ECC LRDIMM, DDR4-1866MHz, in 24 DIMM slots’ LRDIMM and RDIMM support up to 3TB with 128GB DIMM size
Memory Type: 1866/1600/1333/1066/800MHz ECC DDR4 SDRAM 72-bit, 288-pin gold-plated DIMMs
DIMM Sizes: RDIMM: 8GB, 16GB, 32GB, 64GB, 128GBLRDIMM: 8GB, 16GB, 32GB, 64GB, 128GB3DS LRDIMM: 16GB, 32GB, 64GB, 128GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errors Detects double-bit errors (using ECC memory)
Chipset: Intel® C602J
SATA: (on Storage board)
Network Controllers: Quad LAN with Patsburg-J Chipset(on PCH board)
Graphics: (on PCH board)
USB: (on PCH board)
Video Output: (on PCH board)
Others: (TPM header on PCH board)
PCI-E: 1 PCI-E 3.0 x16,1 PCI-E 3.0 x8
BIOS Type: AMI UEFI
Software: IPMI (Intelligent Platform Management Interface) v2.0 with KVM support
Voltage: +1.5V, +12V, +3.3V(on PCH board)
FAN: 8x 4-pin fan headers (up to 8 fans), 8x fans with tachometer monitoring(on BPN-X10OBi board)
Temperature: Thermal Monitor 2 (TM2) support
LED: CPU / System Overheat LED, Memory DIMM ECC error LEDs
Other Features: 4x 8-pin GPU power connectors, RoHS, RoHS, Halogen Free, SDDC