UP Storage SuperServer SSG-110P-NTR10

Key Applications

  • Virtualization
  • Cloud Computing
  • All Flash Storage
  • CDN Optimized

Key Features

  1. Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors. Up to 270W TDP.
  2. 8 DIMMs’ Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® Intel® DCPMM
  3. 1 PCIe 4.0 x16 (FHHL) slot
  4. Intel® Ethernet Controller X550 2x 10GbE RJ45
  5. 10x Hot-swap 2.5» All NVMe Gen 4 tool-less drive bays’ Onboard 2x NVMe Gen 3/SATA M.2
  6. Redundant Platinum 860W Power Supply

CPU: Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors
Core Count: Up to 40C/80T’ Up to 60MB Cache
Note: Supports up to 270W TDP CPUs (Air Cooled)
Memory: Slot Count: 8 DIMM slots Max Memory (1DPC): Up to 2TB 3200MT/s ECCDDR4 RDIMM/LRDIMM Supports Intel® Optane™ persistent memory 200 seriesView Memory Options
Memory Voltage: 1.2V
NVMe: NVMe’ RAID 0/1/5/10 support(Intel® VROC RAID key required)View NVMe Options
Chipset: Intel®C621A
Network Connectivity: 2 RJ45 10GbE with Intel® X550 View AOC Options
LAN: 2 RJ45 1 GbELAN port(s) 1 RJ45 1 GbE Dedicated IPMI LAN port(s)(IPMI shared on LAN port 1)
USB: 2 USB 2.0port(s) (header) 2 USB 3.2 Gen1 Type-A port(s) (rear) 2 USB 2.0 Type-A port(s) (rear) 2 USB 3.2 Gen1 Type-A port(s) (front) 1 USB 3.2 Gen1 Type-A port(s)
Video: 1 VGAport(s)
Serial: 1 COMport(s) (Rear) 1 COMport(s) (Header)
DOM: 2 SuperDOM (Disk on Module)port(s) with built-in power
TPM: 1 TPM header
BIOS Type: AMI 32MB SPI Flash EEPROM
Software: SuperCloud Composer Supermicro Server Manager (SSM) Supermicro Update Manager (SUM) Supermicro SuperDoctor® 5 (SD5) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Power configurations: ACPI/APM Power Management
Hardware: Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features: Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery System Lockdown
CPU: Monitors for CPU Cores, Chipset Voltages, Memory 7+1 Phase-switching voltage regulator module (VRM)
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 1U Rackmount
Model: CSE-116TS-R860CBP-N10
Height: 1.7″ (43 mm)
Width: 17.2″ (437 mm)
Depth: 23.5″ (597 mm)
Package: 8″ (H) x 24″ (W) x 32″ (D)
Weight: Gross Weight: 38 lbs (17.24 kg) Net Weight: 25 lbs (11.34 kg)
Available Color: Black
LED: Device Activity LAN 1 Activity LAN 2 Activity Power status System information
Buttons: Power On/Off  UID button
PCI-Express (PCIe) Configuration: Default1 PCIe 4.0 x16 FHHL slot(s) View AOC Options
Drive Bays Configuration: Default: Total 10 bay(s)10 front hot-swap 2.5″ PCIe 4.0NVMe drive bay(s) View NVMe Options
M.2: 2 M.2 PCIe 3.0 x4 NVMe/SATA slot(s) (M-key 2280/22110′ VROC required for RAID)View M.2 Options
Fans: 6 Counter-rotating PWM 40x40x56mm Fan(s)
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)

Part Number Qty Description
MCP-280-00033-0N 1 Universal Thermal sensor kit with 80cm I2C cable

AOC-VROCINTMOD

1 Intel SSD Only Upgrade module' RAID 0/1/10/5

AOC-VROCSTNMOD

1 Standard Upgrade module (Intel + 3rd party Vendor SSD)' RAID 0/1/10

AOC-VROCPREMOD

1 Premium Upgrade module (Intel + 3rd party Vendor SSD)' RAID 0/1/10/5

SFT-DCMS-Single

1 DataCenter Management Package (per node license)
AOM-TPM-9670H-S-O 1 TPM 2.0, horizontal form factor, provisioned for server
AOM-TPM-9671H-S-O 1 TPM 1.2, horizontal form factor, provisioned for server

Форма заявки