CPU: Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors
Core Count: Up to 32C/64T’ Up to 48MB Cache per CPU
Note: Supports up to 185W TDP CPUs (Air Cooled)
Memory: Slot Count: 16 DIMM slots Max Memory (2DPC): Up to 4TB 3200MT/s ECCDDR4 RDIMMView Memory Options
Memory Voltage: 1.2V
Chipset: Intel®C621A
Network Connectivity: 2 RJ45 10GBASE-T with Intel® X710-AT2 View AOC Options
LAN: 1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB: 2 USB 3.0port(s) (rear)
Video: 1 VGAport(s)
BIOS Type: AMI 32MB SPI Flash EEPROM
Software: SuperCloud Composer Supermicro Server Manager (SSM) Supermicro Update Manager (SUM) Supermicro SuperDoctor® 5 (SD5) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Power configurations: Power-on mode for AC power recovery ACPI Power Management ACPI/APM Power Management
Hardware: Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features: Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery System Lockdown
CPU: Monitors for CPU Cores, Chipset Voltages, Memory 5 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 2U Rackmount
Model: CSV-217HQ+-R2K20BP4
Height: 3.47″ (88 mm)
Width: 17.25″ (438 mm)
Depth: 28.75″ (730 mm)
Package: 10″ (H) x 24.5″ (W) x 45″ (D)
Weight: Gross Weight: 90 lbs (40.9 kg) Net Weight: 72 lbs (32.7 kg)
Available Color: Black front & silver body
LED: Network activity LED Power status LED System information (overheat/UID) LED
Buttons: Power On/Off button UID button
PCI-Express (PCIe) Configuration: Default1 PCIe 4.0 x16 (in x16) LP slot(s) View AOC Options
Drive Bays Configuration: Default: Total 6 bay(s)6 front hot-swap 2.5″ SAS/SATA drive bay(s) View Drive Options
M.2: View M.2 Options
Fans: 4x 8cmheavy duty fans with optimal fan speed control
Air Shroud: 4 Air Shroud(s)
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
Key Applications
- High Performance Computing
- Hyper-Converged Infrastructure
- Big Data / Big Science
Key Features
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors
- Intel® C621A Chipset
- 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
- 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22×80 mm)
- Intel® X710 Dual port 10GBase-T LAN onboard
- 6x 2.5″ hot-swap SATA/SAS drive bays
- 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)
- Two 2200W redundant power supplies with PMBus
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- Broadcom® 3808 SAS (12Gbps)’ 6 slots per node’ HBA only, no RAID support.
- ASPEED AST2600 BMC, 2 USB, VGA. RoT
Part Number | Qty | Description |
AOM-TPM-9670H-O
|
1 | SPI capable TPM 2.0 with Infineon 9670 controller with Horizontal form factor |
AOM-TPM-9671H-O | 1 | SPI capable TPM 1.2 with Infineon 9670 controller with Horizontal form factor |
AOC-VROCPREMOD |
1 | Intel VROC Premium, RAID 0, 1, 5, 10 |
AOC-VROCSTNMOD |
1 | Intel VROC Standard, RAID 0, 1, 10 |