SSG-1029P-NES32R: SuperStorage 1029P-NES32R (Black)
CPU: Dual Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ,3 UPI up to 10.4GT/s Support CPU TDP 70-205W
Cores: Up to 28 Cores
Note: BIOS version 3.2or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
Memory Capacity: 24 DIMM slots Up to 6TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM Supports Intel® Optane™ DCPMM
Memory Type: 2933 /2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note: 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro Cascade Lake only. Contact your Supermicro sales rep for more info.
Chipset: Intel® C627 chipset
Storage: PCI-E fan out switching supporting 32x E1.S
Network Connectivity: Intel® X550 Dual Port 10GBase-T
IPMI: Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics: ASPEED AST2500 BMC
LAN: 2 RJ45 10GBase-T ports 1 RJ45 Dedicated IPMI LAN port
USB: 2 USB 3.0 ports (front) 2 USB 3.0 ports (rear)
Video: 1 VGA D-Sub connector port
Serial Header: 1 COM port (header)
BIOS Type: AMI 32Mb SPI Flash ROM
Software: Intel® Node Manager IPMI 2.0 KVM with dedicated LAN NMI SSM, SPM, SUM SuperDoctor® 5 Watch Dog
Power Configurations: ACPI / APM Power Management
CPU: Monitors for CPU Cores, Chipset Voltages, Memory. 4+1 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 1U Rackmount
Model: CSE-121EF-R1K62P
Height: 1.7″ (43mm)
Width: 17.2″ (437mm)
Depth: 30″ (762mm)
Weight: Net Weight: 40 lbs (18.1kg) Gross Weight: 52 lbs (23.6kg)
Available Color: Black
Buttons: Power On/Off button UID button
LEDs: Power LED Hard drive activity LED Network activity LEDs System Overheat LED / Fan fail LED / UID LED
PCI-Express: 2 PCI-E 3.0 x16 (FHHL) slots 1 PCI-E 3.0 x4 (LP) slot
Hot-swap: 32 Hot-swap PCI-E E1.S drive slots
Fans: 8x 40x56mm counter-rotation PWM fan
Total Output Power: 1600W/1000W
Dimension(W x H x L): 73.5 x 40 x 203 mm
Input: 100-127Vac / 13 — 9A / 50-60Hz 200-240Vac / 10 — 8A / 50-60Hz
+12V: Max: 83.3A / Min: 0A (100-127Vac) Max: 133A / Min: 0A (200-240Vac)
12Vsb: Max: 2.1A / Min: 0A
Output Type: 25 Pairs Gold Finger Connector
Certification: Titanium Level [ Test Report ]
RoHS: RoHS Compliant
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
— IOPS Intensive Application
— Database Application
— Hyperconverged Infrastructure
Key Features
1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)
2. 24 DIMMs’ up to 6TB 3DS ECC
DDR4-2933MHz RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM
3. 2 PCI-E 3.0 x16 (FHHL) slots,
1 PCI-E 3.0 x4 (LP) slot
4. 32 Hot-swap PCI-E E1.S or
M.2 drive bays (M.2 is not
hot-swappable). M.2 supports
Form Factor 22×42/60/80/110
(MCP-220-12106-0N tray required)
5. 2x 10GBase-T LAN ports via
Intel X550
6. 8x 40x56mm counter-rotation
PWM fans
7. 1600W Redundant Power Supplies
Titanium Level (96%)
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