SYS-F629P3-RTB: SuperServer F629P3-RTB (Black)
CPU: Dual Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ,Dual UPI up to 10.4GT/s Support CPU TDP 70-165W with IVR
Cores: Up to 28 Cores
Note: BIOS version 3.2or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R). Extended thermal solutions may be required to support CPUs higher than 165W TDP, please contact Supermicro Technical Support for additional information.
Memory Capacity: 12 DIMM slots Up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM Supports Intel® Optane™ DCPMM
Memory Type: 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note: † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro Cascade Lake only. Contact your Supermicro sales rep for more info.
Chipset: Intel® C621 chipset
SATA: SATA3 (6Gbps)
Network Controllers: Flexible networking viaSIOM
IPMI: Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics: ASPEED AST2500 BMC
LAN: SIOM flexible Network card 1 RJ45 Dedicated IPMI LAN port
USB: 2 USB 3.0 ports (rear)
VGA: 1 VGA port
BIOS Type: 128Mb SPI Flash EEPROM with AMI BIOS
Software: Intel® Node Manager IPMI 2.0 KVM with dedicated LAN SuperDoctor® 5 Watch Dog
Power Configurations: ACPI Power Management
CPU: Monitors for CPU Cores, Chipset Voltages, Memory. 4+1 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 4U Rackmount
Model: CSE-F424AS2-R1K23BP
Width: 17.63″ (448mm)
Height: 6.96″ (177mm)
Depth: 29″ (737mm)
Package: 28.3″ (W) x 15.0″ (H) x 42.4″ (D)
Weight: Net Weight: 150 lbs (68.04 kg) Gross Weight: 200 lbs (90.71 kg)
Available Colors: Black
Buttons: Power On/Off button UID button
LEDs: Power status LED Hard drive activity LED Network activity LEDs Information LED (UID, Fan failure, Overheat)
PCI-Express: 1 PCI-E 3.0 x16 (Low-profile) 1 PCI-E 3.0 x16 (SIOM)
Hot-swap: 8 Hot-swap 3.5″ SATA3 drive bays
M.2: M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key
Fans: 2x 8cm 14k RPM middle fans
Total Output Power: 1000W/1200W
Dimension(W x H x L): 76 x 40 x 336 mm
Input: 100-127Vac / 15-12A / 50-60Hz 200-240Vac / 8.5-7A / 50-60Hz 200-240Vdc / 8.5-7A (for CCC only)
+12V: Max: 83A / Min: 0A (100-127Vac) Max: 100A / Min: 0A (200-240Vac) Max: 100A / Min: 0A (200-240Vdc)
+5Vsb: Max: 4A / Min: 0A
Output Type: 19 Pairs Gold Finger Connector
Certification: Titanium Level [ Test Report ]
RoHS: RoHS Compliant
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
4 Hot-plug System Nodes in 4U
Each node supports:
1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)
2. 12 DIMMs’ up to 3TB 3DS ECC
DDR4-2933MHz† RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM
3. Expansion slots: 1 PCI-E 3.0 x16 (LP)
1 PCI-E 3.0 x16 (for SIOM)
4. SIOM Network card,
1 dedicated IPMI LAN port
5. 1 VGA, 2 USB 3.0 ports
6. 8 Hot-swap 3.5″ SATA3 drive bays
M.2 Interface: PCI-E 3.0 x4
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-Key
7. 2x 8cm 14k RPM middle fans
8. 1200W Redundant Power Supplies
Titanium Level (96% Efficiency)
Part Number | Qty | Description |
SFT-OOB-LIC
|
1 | OOB Management Package (per node license) |
SFT-DCMS-Single |
1 | DataCenter Management Package (per node license) |