SYS-6049GP-TRT: SuperServer 6049GP-TRT
CPU: Dual Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ,3 UPI up to 10.4GT/s Support CPU TDP 70-205W
Cores: Up to 28 Cores
Note: BIOS version 3.2or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
Supported GPUs: 20 Double-Width/Single-Width PCI-E 3.0 x16 Card (Full Height Full Length) NVIDIA T4 Compatible GPU list
CPU-GPU Interconnect: PCI-E Gen 3 x16 Switch CPU-GPU Interconnect
GPU-GPU Interconnect: PCI-E, NVIDIA® NVLink™ Bridge (Optional)
Memory Capacity: 24 DIMM slots Up to 6TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM Supports Intel® Optane™ DCPMM
Memory Type: 2933 /2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note: 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro Cascade Lake only. Contact your Supermicro sales rep for more info.
Chipset: Intel® C622 chipset
SATA: SATA3 (6Gbps) with RAID 0, 1, 5, 10
Network Controllers: Dual Port 10GbE from C622
IPMI: Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics: ASPEED AST2500 BMC
SATA: 24 SATA3 (6Gbps) ports
LAN: 2 RJ45 10GBase-T LAN ports 1 RJ45 Dedicated IPMI LAN port
USB: 4 USB 3.0 ports (rear)
Video: 1 VGA Connector
COM Port: 1 COM port (header)
BIOS Type: AMI 32Mb SPI Flash ROM
Software: Intel® Node Manager IPMI 2.0 KVM with dedicated LAN SSM, SPM, SUM SuperDoctor® 5 Watchdog
CPU: Monitors for CPU Cores, Chipset Voltages, Memory. 4+1 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 4U Rackmountable Rackmount Kit (MCP-290-00057-0N)
Model: CSE-848GTS-R4000P
Height: 7.0″ (178mm)
Width: 17.2″ (437mm)
Depth: 32.1″ (815mm)
Weight: Net Weight: 65.5 lbs (29.7 kg) Gross Weight: 100 lbs (45.3 kg)
Available Colors: Black
Hot-swap: 24 Hot-swap 3.5″ drive bays or 22 Hot-swap 3.5″ drive bays + 2 U.2 NVMe 2.5″ drives
M.2: M.2 Interface: 1 PCI-E 3.0 x4 Form Factors: 2280, 22110 Key: M-Key
PCI-Express: 20 PCI-E 3.0 x16 (FHHL) slots — supporting up to 20 NVIDIA T4 Single-Width GPUs 1 PCI-E 3.0 x8 (FH, FL in x16) slot
Fans: 8x 92mm RPM Hot-Swappable Cooling Fans
Total Output Power: 1000W: 100 – 120Vac 1800W: 200 – 220Vac 1980W: 220 – 230Vac 2000W: 230 – 240Vac 2000W: 200 – 240Vac (UL/CUL only)
Dimension(W x H x L): 73.5 x 40 x 265 mm
Input: 100-120Vac / 12.5-9.5A / 50-60Hz 200-220Vac / 10-9.5A / 50-60Hz 220-230Vac / 10-9.8A / 50-60Hz 230-240Vac / 10-9.8A / 50-60Hz 200-240Vac / 11.8-9.8A / 50-60Hz (UL/cUL only)
+12V: Max: 83.3A / Min: 0A (100-120Vac) Max: 150A / Min: 0A (200-220Vac) Max: 165A / Min: 0A (220-230Vac) Max: 166.7A / Min: 0A (230-240Vac) Max: 166.7A / Min: 0A (200-240Vac) (UL/cUL only)
12Vsb: Max: 2.1A / Min: 0A
Output Type: 25 Pairs Gold Finger Connector
Certification: Titanium Level [ Test Report ]
RoHS: RoHS Compliant
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
— AI/ML, Deep Learning Training and Inference
— Big Data Analytics
— High Performance Computing (HPC)
— Research Laboratory/National Laboratory
— Video Transcoding
— High Performance Computing (HPC)
— Video Transcoding
Key Features
1. Supports 20 NVIDIA® T4 PCI-E
Single-Width GPUs
2. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)
3. 24 DIMMs’ up to 6TB 3DS ECC
DDR4-2933MHz RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM
4. 20 PCI-E 3.0 x16 support
up to 20 single width GPU’
1 PCI-E 3.0 x8 (FH, FL in x16 slot)
5. 24 Hot-swap 3.5″ drive bays or
22 Hot-swap 3.5″ drive bays +
2 U.2 NVMe 2.5″ drives
6. 2x 10GBase-T LAN ports
7. 8 Hot-swap 92mm RPM cooling fans
8. 2000W (2+2) Redundant Power
Supplies Titanium Level (96%+)