SYS-2029U-TRT: SuperServer 2029U-TRT (Black)
CPU: Dual Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ,Dual UPI up to 10.4GT/s Support CPU TDP 70-205W
Cores: Up to 28 Cores
Note: BIOS version 3.2or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
Memory Capacity: 24 DIMM slots Up to 6TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM Supports Intel® Optane™ DCPMM
Memory Type: 2933 /2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM 2666 ECC DDR4 NVDIMM
Note: 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro Cascade Lake only. Contact your Supermicro sales rep for more info.
Chipset: Intel® C621 chipset
SATA: SATA3 (6Gbps)’ RAID 0, 1, 5, 10
Network Connectivity: 2x 10GBase-T ports via Intel® X540 (AOC-2UR68-i2XT)
IPMI: Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics: ASPEED AST2500 BMC
SATA: 14 SATA3 (6Gbps) ports
LAN: 2 RJ45 10GBase-T LAN ports 1 RJ45 Dedicated IPMI LAN port
USB: 5 USB 3.0 ports(2 rear, 2 onboard header, 1 Type A)
Video: 1 VGA Connector
Serial Header: 1 Serial header
DOM: 2 SuperDOM (Disk on Module) ports
BIOS Type: AMI 32Mb SPI Flash ROM
Software: Intel® Node Manager Redfish API IPMI 2.0 KVM with dedicated LAN NMI SSM, SPM, SUM SuperDoctor® 5
Power Configurations: ACPI Power Management
CPU: Monitors for CPU Cores, Chipset Voltages, Memory. 4+1 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 2U Rackmount
Model: CSE-219U2TS-R1K02P-T
Width: 17.2″ (437mm)
Height: 3.5″ (89mm)
Depth: 27.76″ (705.3mm)
Weight: Net Weight: 36 lbs (16.4 kg) Gross Weight: 72 lbs (32.7 kg)
Available Colors: Black
Buttons: Power On/Off button System Reset button
LEDs: Power status LED HDD activity LED Network activity LEDs System information (overheat/UID) LED
PCI-Express: 1 PCI-E 3.0 x16 (FH, 10.5″ L) 5 PCI-E 3.0 x8 (FH, 10.5″ L) 1 PCI-E 3.0 x8 (LP) 1 PCI-E 3.0 x8 (internal LP) (Both CPUs need to be installed for full access to PCI-E slots and onboard controllers. See manual block diagram and AOC Support for details.)
Hot-swap: 24 Hot-swap 2.5″ drive bays’ 14 SATA3 (optional 20 SAS3 + 4 NVMe/SAS3)
M.2: 1 M.2 PCI-E 3.0 x4 M-Key NVMe or 1 M.2 M-Key SATA3 (2240/2260/2280/22110) via optional riser card (see optional parts list) 2 M.2 PCI-E 3.0 x4 M-Key NVMe (2260/2280/22110) via optional add-on card AOC-SLG3-2M2
Fans: 4 Heavy duty 8cm PWM fans
Total Output Power: 800W: 100 – 127Vac 1000W: 200 – 240Vac 1000W: 200 – 240Vdc (for CCC only)
Dimension(W x H x L): 73.5 x 40 x 203 mm
Input: 100-127Vac / 9.8 — 7A / 50-60Hz 200-240Vac / 7 — 5A / 50-60Hz 200-240Vdc / 7 — 5A (for CCC only)
+12V: Max: 66.7A / Min: 0A (100-127Vac) Max: 83A / Min: 0A (200-240Vac) Max: 83A / Min: 0A (200-240Vdc)
12Vsb: Max: 2.1A / Min: 0A
Output Type: 25 Pairs Gold Finger Connector
Certification: Titanium Level [ Test Report ]
RoHS: RoHS Compliant
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
Virtualization
Hyperconverge Storage
Cloud Computing
High End Enterprise Server
Key Features
1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)
2. 24 DIMMs’ up to 6TB 3DS ECC
DDR4-2933MHz RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM
3. 1 PCI-E 3.0 x16 slot (FH, 10.5″ L),
5 PCI-E 3.0 x8 slots (FH, 10.5″ L),
1 PCI-E 3.0 x8 slot (LP),
1 PCI-E 3.0 x8 slot (internal LP)
4. 2x 10GBase-T LAN ports via Intel X540
5. 24 Hot-swap 2.5″ drive bays’ 14 SATA3
(optional 20 SAS3 + 4 NVMe/SAS3),
Optional 2 hot-swap 2.5″ rear drive
bays for SSDs’
Optional M.2 NVMe and SATA3 ports
6. 4 Heavy duty 8cm PWM fans
7. 1000W Redundant Power Supplies
Titanium Level (96%)
Part Number | Qty | Description |
AOC-SLG3-2M2 | 1 | Low Profile PCI-E x8 add-on card supports 2 PCI-E 3.0 x4 M-Key M.2 NVMe Modules |
MCP-290-00128-0N &'
MCP-290-00127-0N |
1 | 2U Supermicro Cable Management Arm 2nd Gen (Compatible for racks that are 42" in depth) |
MCP-120-82916-0N
CBL-0080L CBL-SAST-0654 Or CBL-SAST-0948 |
1
2 1 1 |
Internal drive plate Supports Two 2.5" Drive, PCI slots
miniSAS(iPass) to 4 SATA Cable miniSAS HD to 4 SATA Cable |
2 CBL-SAST-0929 &'
2 CBL-SAST-0972 |
1 | OCuLink source to MiniSAS HD target V.91,INT,PCIe NVMe SSD, 57CM,34AWG |
MCP-220-00167-0B
|
1~4 |
Tool-less black hot-swap 2.5" NVMe drive tray (Orange tab, w/ key lock, clip design)
|
RSC-UMR-8 &'
CBL-SAST-0538 &' MCP-120-82924-0N &' MCP-310-21902-0N |
1 | 1U Ultra RHS Riser Card with 1 PCIE/SATA Hybrid M.2 &'1 PCIE X8 |
MCP-240-82922-0N-OEM | - | Rear 2x 2.5" HDDs riser bracket kit for SC829U/219U, tool-less |
AOC-S3008L-L8e &'
2x CBL-SAST-0593 2x CBL-SAST-0593 2x CBL-SAST-0593 |
1~3 |
Std LP, 8 internal ports, 12Gb/s per port- Gen3, 122HDD, HBA' MINI SAS HD,12G,INT,60CM,30AWG
|
AOC-SGP-i2/4
|
-
|
Standard LP, 2/4x GbE RJ45, PCI-E x4, Intel i350
AOC Compatibility Matrix |
BTR-CV3108-U1 | - | CacheVault for Broadcom 3108 with Supercap mounting for 2U Ultra |
AOM-TPM-9670H-S
AOM-TPM-9671H-S |
1
1 |
TCG 2.0 compliant trusted platform module (TPM), Horizontal FF
TCG 1.2 compliant trusted platform module (TPM), Horizontal FF |
AOC-VROCINTMOD AOC-VROCSTNMOD AOC-VROCPREMOD |
1
|
Intel VROC, RAID 0, 1, 5, 10 (Intel SSD Only)
|
OS4HR3/2/1 OSNBD3/2/1 |
-
|
3/2/1-year onsite 24x7x4 service
|
SFT-OOB-LIC
|
1 | OOB Management Package (per node license) |
SFT-DCMS-Single |
1 | DataCenter Management Package (per node license) |