CPU: Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors
Core Count: Up to 36C/72T’ Up to 54MB Cache per CPU
Note: Supports 120W — 205W TDP CPUs (Air Cooled)
Memory: Slot Count: 16 DIMM slots Max Memory (2DPC): Up to 4TB 3200MT/s ECCDDR4 RDIMM/LRDIMMView Memory Options
Memory Voltage: 1.2V
Chipset: Intel®C621A
Network Connectivity: 2 RJ45 10GBASE-TView AOC Options
LAN: 1 RJ45 1 GbE Dedicated IPMI LAN port(s) 2 RJ45 10 GBASE-TLAN port(s)
USB: 2 USB 3.0port(s) (rear)
Video: 1 VGAport(s)
DOM: 2 SuperDOM (Disk on Module)port(s)
BIOS Type: AMI 128MB SPI Flash EEPROM
Software: SuperCloud Composer Supermicro Server Manager (SSM) Supermicro Update Manager (SUM) Supermicro SuperDoctor® 5 (SD5) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Power configurations: Power-on mode for AC power recovery ACPI Power Management
Hardware: Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features: Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery System Lockdown
CPU: Monitors for CPU Cores, Chipset Voltages, Memory 4+1 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 4U Rackmount
Model: CSV-947HTS-R2K63P
Height: 7″
Width: 17.6″
Depth: 42.1″
Package: 29.92″ (H) x 35.82″ (W) x 53.15″ (D)
Weight: Gross Weight: 240 lbs (108.86 kg) Net Weight: 150 lbs (68.04 kg)
Available Color: Black
PCI-Express (PCIe) Configuration: Default3 PCIe 4.0 x16 LP slot(s) View AOC Options
Drive Bays Configuration: Default: Total 92 bay(s)90 top-loading hot-swap 3.5″/2.5″ SAS/SATA drive bay(s) 2 top-loading fixed 2.5″ SATA drive bay(s) View Drive Options
M.2: 1 M.2NVMe slot(s) (M-key)View M.2 Options
Fans: 6 Heavy Duty 8cm Fan(s)
ROHS: RoHS Compliant
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (Non-Condensing) Non-operating Relative Humidity: 5% to 95% (Non-Condensing)
Key Applications
- Big Data &’ Analytics, Data Lake
- HPC and AI/ML Workloads
- Telco &’ Cloud Service Providers
- Financial Services &’ Healthcare Image Archives
- Content Repositories
- Government Data Protection
Key Features
Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following:
- Dual socket 3rd Gen Intel® Xeon® Scalable processors, up to 72 Cores Per Node
- 16 ECC DDR4-3200: LRDIMM/RDIMM
- 3 x PCIe 4.0 x16 HHHL PCIe slots
- 90 3.5″/2.5″ Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 2280 and 22110)
- 6x 8cm hot-swap counter-rotate redundant PWM cooling fans
- 2600W Redundant Power Supplies Titanium Level (96%)
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- Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN
- HBA Controller support via Broadcom® 3616
- Dedicated node to node connectivity featuring high performance NTB PCIe 4.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support
Part Number | Qty | Description |
AOC-S25G-M2S | - | Standard LP, 2x 25GbE SFP28, Mellanox ConnectX-4 LX EN |
AOC-S40G-I2Q | - | Standard LP 2-port 40GbE controller, Intel Fortville XL710 |
AOC-SGP-I2 | - | Standard LP 2-port GbE, Intel 82575 |
More | - | AOC Compatibility Matrix (Select Storage &' Generation) |
AOM-TPM-9670V-O
|
1 | TPM 2.0, vertical form factor, provisioned for server |
AOM-TPM-9671V-O | 1 | TPM 1.2, vertical form factor, provisioned for server |