MicroBlade Server System: MBS-314E-310T
MicroBlade Sled: MBI-310T-4T2N
Motherboard: MBD-B3ST1-CPU-001
MBM-XEM-002+: Broadcom BCM56846 10GbE Low Latency Switch 2x 40G, 4x 10G, and 1x 1G uplinks 56x 10/1Gbps downlinks (MicroBlade) 1 Console port, 1 USB port
Details: See Details
MBM-CMM-FIO: CMM with Front IO support
Details: See Details
CPU: Single Socket H5 (LGA 1200),CPU TDP support up to 95WSupport Intel® Xeon® processor E-2300 series
Cores: Up to 8 cores, 16 threads
Memory Capacity: 4 DDR4 DIMM sockets Supports up to 128GB DDR4 ECC VLP UDIMM
Memory Type: 3200MHz ECC DDR4 UDIMM
DIMM Sizes: 32GB
Memory Voltage: 1.2 V
Error Detection: Corrects single-bit errors Detects double-bit errors (using ECC memory)
Chipset: Intel® C256 chipset
Network Controllers: Dual 10GbE LAN ports
IPMI: Support for Intelligent Platform Management Interface (IPMI) v.2.0 via Chassis Management Module (CMM)
BIOS Type: 128Mb Flash EEPROM
BIOS Features: Plug and Play (PnP) APM 1.2 SMBIOS 2.7.1
Height: 5.215″ (132.5mm)
Width: 17.67″ (449mm)
Depth: 36.10″ (917mm)
Weight: Gross Weight: 139.20 lbs (63.14 kg)
Available Colors: Silver Grey
LEDs: Power LED Fault LED Network Activity LED UID / KVM LED
Internal: 2x 2.5″ U.2 NVMe (7mm) drives
M.2: M.2 Interface: 1 PCI-E 3.0 x4 M.2 Form Factor: 2280/22110 M.2 Key: M-Key
Others: 1x SATA DOM
TPM: 1 TPM Header
Environmental Spec.: Operating Temperature: 10°C to 38°C (50°F to 100.4°F) Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
United States / Canada: FCC- Emissions (US) Verification
Europe: EN55022 — Emissions EN55024 — Immunity EN61000-3-2 — Harmonics EN61000-3-3 — Voltage Flicker CE — EMC Directive 89/336/EEC
MicroBlade Server System MBS-314E-310T
Key Applications
— Cyber Security
— Cloud Service — Dedicated Hosting
— Cloud Service — Dynamic Front End Web
— Visual &’ Audio — Media Delivery Transcoding
Key Features
1. 196 UP nodes per 42U Rack
2. 14 UP nodes in 3U
3. Per blade supports Intel® Xeon®
processor E-2300 series
4. Per blade support up to 128GB ECC VLP UDIMM
5. Per blade support up to
2x 2.5″ U.2 NVMe (7mm) drives
6. Per System supports 10GbE LAN and
two switch modules for redundancy
7. Per system supports Central Management Module
8. Front-loading nodes for easy and servicing
9. N+1 or N+N power redundancy with
Titanium level efficiency (96%)
10. Out of Band (OOB)
software management licenses
| Part Number | Qty | Description |
|
AOM-TPM-9670V
|
1 |
TPM module (Vertical) TPM 2.0
|
| - | - |
Supermicro SATA DOM Solutions [
Details ] |
| SNK-P1040V | - | Low Profile Proprietary Passive CPU Heat Sink for B2SC1 Associated Micro Blade Servers |
|
MEM-IDSAHT1-032G
MEM-IDSAHT1-064G MEM-IDSAHT1-128G MEM-IDSAHT1-256G MEM-IDSAHM3A-016G MEM-IDSAHM3A-032G MEM-IDSAHM3A-064G MEM-IDSAHM3A-128G |
1 |
IND SATA3 DOM SH 3TE7 32GB 3D TLC w/Pin8 VCC Horizontal
IND SATA3 DOM SH 3TE7 64GB 3D TLC w/Pin8 VCC Horizontal IND SATA3 DOM SH 3TE7 128GB 3D TLC w/Pin8 VCC Horizontal IND SATA3 DOM SH 3TE7 256GB 3D TLC w/Pin8 VCC Horizontal IND SATA3 DOM SH 3TE7 32GB 3D TLC w/Pin8 VCC Horizontal IND SATA3 DOM SH 3TE7 64GB 3D TLC w/Pin8 VCC Horizontal IND SATA3 DOM SH 3TE7 128GB 3D TLC w/Pin8 VCC Horizontal IND SATA3 DOM SH 3TE7 256GB 3D TLC w/Pin8 VCC Horizontal SATA3 DOM SH 3ME3 V2 16GB MLC w/ Pin8 VCC Horizontal SATA3 DOM SH 3ME3 V2 32GB MLC w/ Pin8 VCC Horizontal SATA3 DOM SH 3ME3 V2 64GB MLC w/ Pin8 VCC Horizontal SATA3 DOM SH 3ME3 V2 128GB MLC w/ Pin8 VCC Horizontal |
|
SFT-DCMS-Single |
1 | DataCenter Management Package (per node license) |