CPU: Single Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores
Core Count: Up to 144C/144T’ Up to 108MB Cache
Note: Supports up to 350W TDP CPUs (Air Cooled)
Memory: Slot Count: 16 DIMM slots/2 Channels Max Memory (2DPC): Up to 1TB 6400MT/s ECCDDR5 RDIMMView Memory Options
NVMe: NVMe’ RAID 0/1/5/10 support(VROC HW key required)View NVMe Options
Chipset: System on Chip
Network Connectivity: Via IO ModuleView AIOM Options View AOC Options
LAN: 1 RJ45 1 GbE Dedicated BMC LAN port(s)
USB: 2 USB 3.0port(s)
Video: 1 VGAport(s)
BIOS Type: AMI 64MB Flash ROM
Software: SuperCloud Composer Supermicro Server Manager (SSM) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Hardware: Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features: Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment
CPU: Monitors for CPU Cores, Chipset Voltages, Memory. 8+4 Phase-switching voltage regulator
Form Factor: 2U Rackmount
Model: CSV-GT214E-R3K01TBP
Height: 3.46″ (88 mm)
Width: 17.67″ (449 mm)
Depth: 28″ (711.2 mm)
Package: 9.76″ (H) x 24.65″ (W) x 45.28″ (D)
Weight: Gross Weight: 88 lbs (39.9 kg) Net Weight: 68 lbs (30.8 kg)
Available Color: Silver
LED: HDD activity LED Network activity LEDs Power status LED Universal Information (UID) LED
Buttons: Power On/Off button UID button
PCI-Express (PCIe) Configuration: Default*1 PCIe 5.0 x16 LP slot(s)(*Requires additional parts, please see the optional parts list for details. For more details on PCIe slot configuration options, please refer to the system callout images above.)View AOC Options
M.2: 2 M.2 PCIe 5.0 x4 NVMe slot(s) (M-key 22110(default)’ VROC required for RAID)
Drive Bays Configuration: Default: Total 8 bay(s)8 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bay(s)Option A: Total 4 bay(s)4 front hot-swap E1.S PCIe 5.0 x4 NVMe* drive bay(s)Option B: Total 4 bay(s)4 front hot-swap 2.5″ PCIe 5.0 x4 NVMe* drive bay(s)Option C: Total 2 bay(s)2 front hot-swap 2.5″ PCIe 5.0 x4 NVMe* drive bay(s)(*NVMe support may require additional storage controller and/or cables, please see the optional parts list for details)View NVMe Options View Drive Options
M.2: 2 M.2 PCIe 5.0 x4 NVMe slot(s) (M-key 22110(default)/2280′ USB 2.0′ VROC required for RAID)View M.2 Options
Fans: 2x 16K RPM Heavy Duty 8cm Fan(s)
ROHS: RoHS Compliant
Environmental Spec.: Operating Temperature: 5°C ~ 40°C (41°F ~ 104°F) Non-operating Temperature: -30°C to 60°C (-22°F to 140°F) Operating Relative Humidity: 8% to 80% (non-condensing) Non-operating Relative Humidity: 8% to 90% (non-condensing)
Key Applications
- Enterprise Applications
- Scale-Out Object Storage
- Cloud Computing, Compact Server
- Web/Hosting Application
- Cloud Gaming
- MEC (Multi-Access Edge Computing)
- Multi-Purpose CDN
- Telco Edge Cloud
- Mission Critical Web Applications
- IoT Edge Computing / Gateway
- Edge AI Inferencing
Key Features
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
- Highly configurable 2U 4-Node front access nodes for cold aisle serviceability with up to 8x E1.S NVMe drives per node
- 1 PCIe 5.0 x16 LP slot(offering with 4x E1.S drives), or 1 OCP3.0 slot (offering with 2x U.2 drives) for networking expansions
- GrandTwin front IO module offers additional networking options (10G/25G/200G) with NCSI support
- Single-Socket, Intel® Xeon® 6 6700 series processors with E-cores
- 16 DIMM Slots supporting up to 1TB of memory’ ECC RDIMMs up to DDR5-6400
Part Number | Qty | Description |
MCP-120-21406-0N | 1 | GT214 FIO AIOM dummy bracket |
MCP-450-21413-ASM | 0 - 1 | GT214 front AIOM 80W KIT |
CBL-PWCD-0200 | 0-2 | PWCD, IEC60320, C20 to C21,12AWG,1.8M |
MCP-220-12603-0B | 0-8 | E1.S_FRONT_LATCH_ASM with Tray (33.75mm height x15mm W) |
AOC-GTG-I2T-O | 1 | Grand Twin I/O card 2-Port 10GbE RJ45, Intel Carlsville X710-AT2, w/ 1x BMC dedicated LAN/RJ45 PORT, 2x USB 3.0 &' 1x VGA port.,RoHS |
AOC-GTG-B2T-O | 1 | Grand Twin I/O card 2-Port 10GbE RJ45, Broadcom BCM57416, w/ 1x BMC dedicated LAN/RJ45 PORT, 2x USB 3.0 &' 1x VGA port.,RoHS |
AOC-G25G-M2S-O | 1 | Grand Twin I/O card 2-Port 25GbE SFP28, Mellanox CX-4 Lx EN, w/ 1x BMC dedicated LAN/RJ45 PORT, 2x USB 3.0 &' 1x VGA port.,RoHS |
MCP-220-21411-0N | 0-4 | GT214E FIO 8x E1.S MB tray |
MCP-220-21410-0N | 0-4 | GT214E FIO 4x E1.S MB tray |
MCP-220-21401-0N | 0-4 | GT214 FIO U.2 MB tray w/o HDD cage |
MCP-120-21401-0N | 0 - 2 | GT214 FIO HDD dummy bracket(1slot) |
MCP-450-21408-ASM | 0 - 2 | GT214BF PCIe Gen5 FIO KIT of U.2 NVMe x2 |
PWS-2K21A-BR
|
0-2 | 2200W Titanium Power Supply' LxWxH: 245.3x106.5x84mm |
PWS-3K01A-BR
|
0-2 | 3000W Titanium Power Supply' LxWxH: 245.3x106.5x82.1mm, C20 inlet |
MCP-290-00172-0N | 0-1 | 2U non-tip rail set, quick release, default for 2,3U 17.6"(W) |
AOM-TPM-9670V-S-P | 0-1 | SPI Capable TPM 2.0 Provisioned for Server, Vertical Form Factor |
AOC-VROCPREMOD |
0-1 | Intel VROC Premium, RAID 0, 1, 5, 10 |
AOC-VROCSTNMOD |
0-1 | Intel VROC Standard, RAID 0, 1, 10 |