CPU: Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Core Count: Up to 64C/128T’ Up to 128MB Cache per CPU
Note: Supports up to 350W TDP CPUs (Air Cooled)
Max GPU Count: Up to 8 onboardGPU(s)
Supported GPU: Intel OAM: Data Center GPU Max 1550View GPU Options
CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect: Intel® Xe Link Bridges
Memory: Slot Count: 32 DIMM slots Max Memory (2DPC): Up to 8TB 5600MT/s ECCDDR5 RDIMMView Memory Options
Memory Voltage: 1.1V
Chipset: Intel®C741
Network Connectivity: 2 RJ45 10GbE with Intel® X550-AT2 (optional)View AOC Options
LAN: 1 RJ45 1 GbE Dedicated IPMI LAN port(s)
USB: 2 USB 3.2 Gen1port(s) (front)
Video: 1 VGAport(s)
BIOS Type: AMI 32MB SPI Flash EEPROM
Software: SuperCloud Composer Supermicro Server Manager (SSM) Supermicro Update Manager (SUM) Supermicro SuperDoctor® 5 (SD5) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Power configurations: Power-on mode for AC power recovery ACPI Power Management
Hardware: Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features: Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
CPU: 8+4 Phase-switching voltage regulator
Form Factor: 8U Rackmount
Model: CSE-GP801TS-R000NPF
Height: 13.8″ (356 mm)
Width: 17.7″ (447 mm)
Depth: 33.2″ (843 mm)
Package: 27.6″ (H) x 51″ (W) x 29.5″ (D)
Weight: Gross Weight: 196.21 lbs (89 kg) Net Weight: 130.07 lbs (59 kg)
Available Color: Silver
Buttons: UID button
PCI-Express (PCIe) Configuration: Default8 PCIe 5.0 x16 LP slot(s) 4 PCIe 5.0 x16 FHHL slot(s) View AOC Options
Drive Bays Configuration: Default: Total 19 bay(s)3 front hot-swap 2.5″ SATA drive bay(s) 16 front hot-swap 2.5″ NVMe drive bay(s) View Drive Options
M.2: 2 M.2NVMe/SATA slot(s) (M-key 2280/22110)View M.2 Options
Fans: 10 Removable heavy-duty 8cm Fan(s)
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
Key Applications
- High Performance Computing
- AI/Deep Learning Training
- Industrial Automation
- Business Intelligence &’ Analytics
- Climate and Weather Modeling
- Biomedical
- Generative AI
- Finance Services and Fraud Detection
Key Features
-
- High Density Computing: 8 x Intel® Data Center GPU Max 1550 (600W) OAM
- Performance: 6.7 petaFLOPS FP16/BF16
- GPU Memory: 1TB HBM2
- GPU Memory Bandwidth: 3276.8 GB/s
- GPU to GPU Interconnect: 742 GB/s XeLink Scale Up Bandwidth
- Open Ecosystem with oneAPI
- 5th/4th Gen Intel® Xeon® Scalable processors With PCIE Gen 5 Platform
- 32x DIMM slots, ECC DDR5 RDIMM up to 8TB and 5600MTS
Part Number | Qty | Description |
MCP7Y00-N003 | 32 | 3M PASSIVE COPPER SPLITTER CABLE IB 2PORT NDR 800GB OSFP |
AOC-STGS-i2T-O | 1 | 2x 10GbE RJ45 Intel X550-AT2, Gen3 x4 LP |
AOC-CX766003N-SQ0 | 8 | Nvidia 900-9X766-003N-SQ0 PCIe 1-port IB and Ethernet 400GbE OSFP Gen5x16 CX7 |
AOC-623106AN-CDAT | 1 | 2x 100GbE ConnectX-6 Dx Ethernet AdapterCard, QSFP56 |
QM9700 | 1 | 400Gb/s per port 32 octal small form-factor pluggable (OSFP) connectors |