CPU: Dual Socket E (LGA-4677) 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Supports Intel Xeon CPU Max Series with high bandwidth memory (HBM)
Core Count: 64C/128T’ 320MB Cache per CPU
Note: Supports up to 385W TDP CPUs (Liquid Cooled)
Max GPU Count: Up to 8 onboardGPU(s)
Supported GPU: NVIDIA SXM: HGX H100 8-GPU (80GB)View GPU Options
CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect
GPU-GPU Interconnect: NVIDIA® NVLink® with NVSwitch™
Memory: Slot Count: 32 DIMM slots Max Memory (1DPC): 4TB 5600MT/s ECCDDR5 RDIMM Max Memory (2DPC): 8TB 4400MT/s ECCDDR5 RDIMMView Memory Options
Chipset: Intel®C741
Network Connectivity: 2 SFP28 25GbE with Broadcom® BCM57414 (optional) 2 RJ45 10GbE with Intel® X710-AT2 (optional)View AOC Options
Video: 1 VGAport(s)
BIOS Type: AMI 32MB SPI Flash EEPROM
Software: SuperCloud Composer Supermicro Server Manager (SSM) Supermicro Update Manager (SUM) Supermicro SuperDoctor® 5 (SD5) Super Diagnostics Offline (SDO) Supermicro Thin-Agent Service (TAS) SuperServer Automation Assistant (SAA) New!
Power configurations: Power-on mode for AC power recovery ACPI Power Management
Hardware: Trusted Platform Module (TPM) 2.0 Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features: Cryptographically Signed Firmware Secure Boot Secure Firmware Updates Automatic Firmware Recovery Supply Chain Security: Remote Attestation Runtime BMC Protections System Lockdown
CPU: Monitors for CPU Cores, Chipset Voltages, Memory 8+4 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 4U Rackmount
Model: CSE-GP401TS-R000NP
Height: 6.85″ (174 mm)
Width: 17.7″ (449 mm)
Depth: 33.2″ (842 mm)
Package: 13″ (H) x 48″ (W) x 26.4″ (D)
Weight: Gross Weight: 138.89 lbs (63 kg) Net Weight: 80.03 lbs (53 kg)
Available Color: Silver
Buttons: UID button
PCI-Express (PCIe) Configuration: Default8 PCIe 5.0 x16 LP slot(s) 2 PCIe 5.0 x16 FHHL slot(s)Option A8 PCIe 4.0 x16 LP slot(s) 4 PCIe 5.0 x16 FHHL slot(s) View AOC Options
Drive Bays Configuration: Default: Total 8 bay(s)8 front hot-swap 2.5″ NVMe drive bay(s) View NVMe Options View Drive Options
M.2: 2 M.2NVMe slot(s) (M-key)View M.2 Options
Fans: 4 Fan 8cm Fan(s)
Liquid Cooling: Direct to Chip (D2C) Cold Plate (optional)
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
Key Applications
- High Performance Computing
- AI/Deep Learning Training
- Industrial Automation, Retail
- Healthcare
- Conversational AI
- Business Intelligence &’ Analytics
- Drug Discovery
- Climate and Weather Modeling
- Finance &’ Economics
Key Features
- 5th/4th Gen Intel® Xeon® Scalable processor support
- 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5
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- 8 PCIe Gen 5.0 X16 LP
- 2 PCIe Gen 5.0 X16 FHHL Slots, 2 PCIe Gen 5.0 X16 FHHL Slots (optional)
- Flexible networking options
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- 2 M.2 NVMe for boot drive only
- Optional: 8x 2.5″ Hot-swap SATA drive bays
- 8x 2.5″ Hot-swap NVMe drive bays
- 4 heavy duty fans with optimal fan speed control
- 4x 5250W(2+2) Redundant Power Supplies, Titanium Level
Part Number | Qty | Description |
CBL-GNZ2-1221MTS4 | 1 | GenZ 2C+2 mount holes to SlimSAS x8,21cm,31AWG,RoHS |
MCP-220-00147-0B
|
5 | Black gen-3 hot-swap 2.5" Tool-less HDD tray (clip design) |
AOM-DP801-PCIE-P | 1 | NIC Riser board(After Mid-Plane) for Delta-Next GPU System,RoHS |
AOM-DP801-SW-P | 1 | NIC adaptor board with PLX switch for Delta-Next GPU system,RoHS |
CBL-PWEX-1142B-40 | 1 | MicroHi(2x4 to 2x4), PH3.0, 40cm, 8.5A/p, 18AWG, RoHS |
CBL-MCIO-1255M5
|
4 | MCIO x8 (STR to STR),55CM,30AWG,RoHS |