Form Factor: Proprietary
Dimension: 17.01″ x 9.57″ (43.22cm x 24.32cm)
CPU: Intel® Xeon® 6 Processors Dual Socket E2 (LGA-4710) supported, CPU TDP supports Up to 350W TDP, 3 UPI up to 24 GT/s
Core: Up to 144 (E) cores
Memory Capacity: 32 DIMM slots Up to 8TB 3DSECC Registered RDIMM, DDR5-6400MT/s
Memory Type: 6400 MT/s ECC DDR5 RDIMM (3DS)Up to 128GB of memory with speeds of up to 6400 MT/s(1DPC) or 5200 MT/s (2DPC)
DIMM Sizes: 8GB, 16GB, 32GB, 64GB, 128GB, 256GB RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage: 1.1V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset:
Network Controllers: Dual LAN with Intel® Ethernet Controller E810-XXVAM2
USB: 1 USB 3.1 Gen1 port(s) (1 type A)
TPM: 1 TPM TPM 2.0 onboard
PCIe: 6 PCIe 5.0 x8 MCIO connector
M.2: M.2 Interface: 2 PCIe 5.0 x4 Form Factor: 2280 Key: M-Key M.2 support requires an optional M.2 adapter card
BIOS Type: AMI 64MB AMI UEFI
BIOS Features: ACPI 6.5SMBIOS 3.7 or laterUEFI 2.9
Voltage: VBAT, System level control, Supports system management utility, Monitors CPU voltages, +5V standby, +5V, +3.3V, +12V
LED: UID/Remote UID CPU / System Overheat LED
Temperature: Monitoring for CPU and chassis environment CPU thermal trip support Thermal Monitor 2 (TM2) support PECI
FAN: 1x 4-pinfan header (up to 1 fan) Fan speed control
Other Features: UID Control of power-on for recovery from AC power loss Chassis intrusion detection ACPI power management
Key Features
- Intel® Xeon® 6 processors, Dual Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
- Total up to 8TB ECC RDIMM DDR5-6400MT/s in 32 DIMM slots
- 1 PCIe 4.0 x16 Mezzanine connector
- 6 PCIe 5.0 x8 via MCIO connectors
- Dual 25G LAN with Intel®E810
- Onboard TPM2.0
- 1 PCIe 5.0 x8 E1.S connector for dual M.2 support via adapter card
Optimized Servers
SBI-622B-1NE34SBI-622B-5NE34SBI-622B-1NE38SBI-622B-5NE38
Part Number | Qty | Description |
AOM-TPM-9672V |
1 | SPI capable TPM 2.0 with Infineon 9672 controller in vertical form factor |