B12SPE-CPU-25G

Form Factor: Proprietary
Dimension: 9.358″ x 11.408″ (23.77cm x 28.98cm)
CPU: 3rd Gen Intel® Xeon® Scalable processors Single Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 270W TDP
Memory Capacity: 16 DIMM slots Up to 4TB 3DSECC LRDIMM, DDR4-3200MT/s’ Up to 4TB 3DSECC RDIMM, DDR4-3200MT/s
Memory Type: 3200/2933/2666 MT/s ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: N/A
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: Intel® C621A
IPMI: ASPEED AST2600 BMC
Network Controllers: Dual LAN with 25GbE with Mellanox ConnectX-4 Lx EN
PCIe: 1 PCIe 4.0 x8 for Add-On-Module (AOM) Onboard PCIe Gen3/4 x 32 connectors for GPU riser/ PCIe cable One PCIe Gen3/4 x 8 Mezzanine card connector for network AOM
M.2: M.2 Interface: 1 SATA/PCIe 3.0 x4 Form Factor: 2280/22110 Key: M-Key One Hybrid (PCIe Gen3 x 4 /SATA3) M.2 connector from PCH
BIOS Type: 256MB SPI Flash with AMI BIOS
Software: Redfish API, Supermicro Server Manager (SSM), Supermicro Power Manager (SPM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), KVM with dedicated LAN , IPMI 2.0, SSM
System Management Software: IPMI (Intelligent Platform Management Interface) v1.5 / 2.0 with KVM support
Hardware: Trusted Platform Module (TPM) 2.0
Voltage: VBAT, System temperature, PCH temperature, Memory temperature, CPU temperature, Chipset Voltage, 1.05 (PCH), +5V, +3.3V, +12V, Memory Voltages, LAN temperature, +1.8V PCH