AS -2124GQ-NART+: A+ Server 2124GQ-NART+ (Black)
CPU: Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) Socket SP3 Supports CPU TDP up to 280W*
Cores: Up to 128 Cores (64 per CPU)
Note: * Certain CPUs with high TDP may be supported only under specific conditions. Please contact Supermicro Technical Support for additional information about specialized system optimization
Supported GPUs: HGX A100 4-GPU 40GB/80GB SXM4 Multi-GPU Board
CPU-GPU Interconnect: PCI-E Gen 4 x16 Direct Connect CPU-GPU Dual-Root
GPU-GPU Interconnect: NVIDIA® NVLink™ GPU-to-GPU Interconnect
Memory Capacity: 32 DIMM slots Up to 8TB 3DS ECC DDR4-3200MH SDRAM
Memory Type: 3200MHz ECC DDR4 SDRAM
Chipset: System on Chip (SoC)
Network: Dual RJ45 10GbE-aggregate host LAN, RJ45 1GbE IPMI
IPMI: Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics & System Management: ASPEED AST2600 BMC
SATA: 4 SATA3 (6Gbps) ports
LAN: 2 RJ45 10GbE-aggregate host LAN ports 1 RJ45 1GbE Dedicated IPMI management port
USB: 2 USB 3.0 ports (rear)
Video: 1 VGA Connector (rear)
Others: 1 COM port (header) 1 TPM 2.0 (header)
BIOS Type: AMI 256Mb SPI Flash ROM
Software: IPMI 2.0 KVM with dedicated LAN SSM, SPM, SUM SuperDoctor® 5 Watchdog
CPU: Monitors for CPU Cores, Chipset Voltages, Memory. 4+1 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 2U Rackmountable
Model: CSE-228GTS-R3K02P
Height: 3.5″ (89mm)
Width: 17.2″ (437mm)
Depth: ~32.7″ (830.3mm)
Weight: Net Weight: 78.5 lbs (35.6 kg) Gross Weight: 88.5 lbs (40.1 kg)
Package Dimensions: 45.5″ L x 22.5″ W x 11″ H
Available Colors: Black
Hot-swap: 4 Hot-swap 2.5″ drive bays (SATA/NVMe Hybrid or SAS with optional HBA)
PCI-Express: 4 PCI-E Gen4 x16 (LP) slots — supporting HGX A100 4-GPU’s 1:1 connection to 4 NICs 1 PCI-E Gen 4 x8 (LP) slot
Fans: 4 Hot-swap heavy duty fans
Dimension(W x H x L): 106.5 x 82.4 x 203.5 mm
Certification: Titanium Level
RoHS: RoHS Compliant
Environmental Spec.: Operating Temperature:10°C ~ 35°C (50°F ~ 95°F)Non-operating Temperature:-40°C to 60°C (-40°F to 140°F)Operating Relative Humidity:8% to 90% (non-condensing)Non-operating Relative Humidity:5% to 95% (non-condensing)
Key Applications
— AI/ML, Deep Learning Training and Inference
— High-performance Computing (HPC)
— Cloud Computing
— Research Laboratory/National Laboratory
— Autonomous Vehicle Technologies
— Molecular Dynamics Simulation
Key Features
1. High Density 2U System with NVIDIA® HGX™ A100 4-GPU’ Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio)
2. Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
3. Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect
4. On board BMC supports integrated
IPMI 2.0 + KVM with dedicated 10G LAN
5. Dual AMD EPYC™ 7003/7002 Series Processors
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
6. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
7. 4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP)
8. 4 Hot-swap 2.5″ drive bays
(SAS/SATA/NVMe Hybrid)
9. 3000W Redundant Titanium Level (96%+) Power Supplies
(full redundancy based on 40GB HGX A100 4-GPU configuration ONLY and application load)