SYS-1029GP-TR: SuperServer 1029GP-TR
CPU: Dual Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ,3 UPI up to 10.4GT/s Support CPU TDP 70-165W*
Cores: Up to 28 Cores
Note: BIOS version 3.2or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
Supported GPUs: 3 Double-Width/Single-Width PCI-E 3.0 x16 Card (Full Height Full Length) 4 Single-Width GPUs NVIDIA V100, M10, T4, Quadro RTX Compatible GPU list
CPU-GPU Interconnect: PCI-E Gen 4 x16 Direct Connect CPU-GPU Dual-Root
Memory Capacity: 16 DIMM slots Up to 4TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM Supports Intel® Optane™ DCPMM
Memory Type: 2933 /2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note: 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro Cascade Lake only. Contact your Supermicro sales rep for more info.
Chipset: Intel® C621 chipset
SATA: SATA3 (6Gbps) with RAID 0, 1, 5, 10
IPMI: Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics: ASPEED AST2500 BMC
LAN: 1 RJ45 Dedicated IPMI LAN port
USB: 2 USB 3.0 ports (rear)
Video: 1 VGA port
Serial Header: 1 Fast UART 16550 header
BIOS Type: AMI 32Mb SPI Flash ROM
Software: Intel® Node Manager IPMI 2.0 KVM with dedicated LAN SSM, SPM, SUM SuperDoctor® 5 Watch Dog
Power Configurations: ACPI / APM Power Management
CPU: Monitors for CPU Cores, Chipset Voltages, Memory. 4+1 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 1U Rackmount
Model: CSE-118GH-R1K66B2
Height: 1.7″ (43mm)
Width: 17.2″ (437mm)
Depth: 30.6″ (777mm)
Weight: Net Weight: 45 lbs (15.9 kg) Gross Weight: 58 lbs (21.8 kg)
Available Color: Black
Buttons: Power On/Off button System Reset button
LEDs: Power LED Hard drive activity LED Network activity LEDs System Overheat LED / Fan fail LED / UID LED
PCI-Express: 4 PCI-E 3.0 x16 (FHFL) slots — supporting up to 4 GPUs 1 PCI-E 3.0 x8 (in x16, LP) slot
Hot-swap: 4 Hot-swap 2.5″ drive bays
Fans: 10 Heavy duty 4cm counter-rotating fans with air shroud & optimal fan speed control
Total Output Power: 1000W: 100 – 127Vac 1600W: 200 – 240Vac
Dimension(W x H x L): 73.5 x 40 x 265 mm
Input: 100-127Vac / 12.9A Max / 50-60Hz 200-240Vac / 9.5A Max / 50-60Hz
+12V: Max: 82A / Min: 0.1A (100-127Vac) Max: 132A / Min: 0.1A (200-240Vac)
12V SB: Max: 2A / Min: 0.2A
Output Type: 25 Pairs Gold Finger Connector
Certification: Platinum Level [ Test Report ]
RoHS: RoHS Compliant
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
— 3D/2D and CAD Applications
— Cloud Computing
— Edge Computing
— Oil and Gas Exploration
— VDI
— AI/ML, Deep Learning Training and Inference
Key Features
1. Supports 3x double width GPU
or 4 single width GPUs’
Support for passively cooled GPUs
2. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)
3. 16 DIMMs’ up to 4TB 3DS ECC
DDR4-2933MHz RDIMM/LRDIMM,
Supports Intel® Optane™ DCPMM
4. 4 PCI-E 3.0 x16 (FHFL) slots,
1 PCI-E 3.0 x8 (in x16, LP) slots
5. 2 Hot-swap 2.5″ SAS/SATA drive bays,
2 Hot-swap 2.5″ SATA/NVMe
drive bays
6. 1 SIOMfor flexible Networking
7. 10 Counter rotating fans with
optimal fan speed control
8. 1600W Redundant Power Supplies
Platinum Level (94%)