SuperServer F619P2-RC0

SYS-F619P2-RC0: SuperServer F619P2-RC0 (Black)
CPU: Dual Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors ,Dual UPI up to 10.4GT/s Support CPU TDP 70-165W with IVR
Cores: Up to 28 Cores
Note: BIOS version 3.2or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
Memory Capacity: 12 DIMM slots Up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM Supports Intel® Optane™ DCPMM
Memory Type: 2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note: † 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro Cascade Lake only. Contact your Supermicro sales rep for more info.
Chipset: Intel® C621 chipset
SAS: SAS3 (12Gbps) via Broadcom 3008
Network Controllers: Flexible networking viaSIOM
IPMI: Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics: ASPEED AST2500 BMC
SAS: 6 SAS3 (12Gbps) ports
NVMe: 4 NVMe U.2 option
LAN: SIOM flexible Network card 1 RJ45 Dedicated IPMI LAN port
USB: 2 USB 3.0 ports (rear)
VGA: 1 VGA port
BIOS Type: 128Mb SPI Flash EEPROM with AMI BIOS
Software: Intel® Node Manager IPMI 2.0 KVM with dedicated LAN SuperDoctor® 5 Watch Dog
Power Configurations: ACPI Power Management
CPU: Monitors for CPU Cores, Chipset Voltages, Memory. 4+1 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 4U Rackmount
Model: CSE-F418BC2-R2K20BP
Width: 17.63″ (448mm)
Height: 6.96″ (177mm)
Depth: 29″ (737mm)
Package: 28.3″ (W) x 15.0″ (H) x 42.4″ (D)
Weight: Net Weight: 150 lbs (68.04 kg) Gross Weight: 200 lbs (90.71 kg)
Available Colors: Black
Buttons: Power On/Off button UID button
LEDs: Power status LED Hard drive activity LED Network activity LEDs Information LED (UID, Fan failure, Overheat)
PCI-Express: 1 PCI-E 3.0 x16 (Low-profile) 1 PCI-E 3.0 x16 (SIOM)
Hot-swap: 6 Hot-swap 2.5″ SAS3/SATA3 or 2 Hot-swap 2.5″ SAS3/SATA3 + 4 optional NVMe U.2
M.2: M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key
Fans: 3x 4cm 20k RPM middle fans
Total Output Power and Input: 1200W with Input 100-127Vac 1800W with Input 200-220Vac 1980W with Input 220-230Vac 2090W with Input 230-240Vac 2200W with Input 220-240Vac (for UL/cUL use only) 2090W with Input 230-240Vdc (for CCC only)
AC Input Frequency: 50-60Hz
Dimension(W x H x L): 76 x 40 x 336 mm
+12V: Max: 100A / Min: 0A (100-127Vac) Max: 150A / Min: 0A (200-220Vac) Max: 165A / Min: 0A (220-230Vac) Max: 174.17A / Min: 0A (230-240Vac) Max: 183.3A / Min: 0A (220-240Vac)
5VSB: Max: 1A / Min: 0A
Output Type: Backplanes (gold finger)
Certification:   Titanium Level  [ Test Report ]
RoHS: RoHS Compliant
Environmental Spec.: Operating Temperature:    10°C ~ 35°C (50°F ~ 95°F)Non-operating Temperature:   -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity:   8% to 90% (non-condensing) Non-operating Relative Humidity:   5% to 95% (non-condensing)