SSG-5049P-E1CR45H: SuperStorage 5049P-E1CR45H (Black)
CPU: Single Socket P (LGA 3647) 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors Support CPU TDP up to 165W
Cores: Up to 28 Cores
Note: BIOS version 3.2or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R). Extended thermal solutions may be required to support CPUs higher than 165W TDP, please contact Supermicro Technical Support for additional information.
Memory Capacity: 8 DIMM slots Up to 2TB 3DS ECC DDR4-2933MHz RDIMM/LRDIMM
Memory Type: 2933 /2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note: 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro
Chipset: Intel® C621 chipset
SATA: SATA3 (6Gbps) via Intel® C621 controller RAID 0, 1, 5, 10 support
SAS: Broadcom 3108 SAS3, HW RAID(AOC-S3108L-H8IR-P)
Network Controllers: Dual 1GbE LAN ports with Intel® I210
IPMI: Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics: ASPEED AST2500 BMC
LAN: 2 RJ45 Gigabit Ethernet LAN ports 1 RJ45 Dedicated IPMI LAN port
USB: 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A) 8 USB 2.0 ports (2 rear + 6 headers)
VGA: 1 VGA port
Serial Port / Header: 2 COM Ports (1 rear, 1 header)
BIOS Type: AMI UEFI
Software: Intel® Node Manager IPMI 2.0 KVM with dedicated LAN NMI SPM, SUM SuperDoctor® 5 Watch Dog
Power Configurations: ACPI Power Management
CPU: Monitors for CPU Cores, Chipset Voltages, Memory. 4+1 Phase-switching voltage regulator
FAN: Fans with tachometer monitoring Status monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment Thermal Control for fan connectors
Form Factor: 4U Rackmount
Model: CSE-946LTS-R1K66P1
Width: 17.2″ (437mm)
Height: 7″ (178mm)
Depth: 26″ (660mm)
Weight: Gross Weight: 120 lbs (54.43 kg) Net Weight: 85 lbs (38.56 kg)
Buttons: Power On/Off button System Reset button
LEDs: Power status LED Hard drive activity LED Network activity LEDs System Information LED Power fail LED
PCI-Express: 2 PCI-E 3.0 x8 (in x16) 3 PCI-E 3.0 x8 1 PCI-E 3.0 x4 (in x8) 1 PCI-E 3.0 x8 (occupied by HBA card)
M.2: 1x M.2 Interface: PCI-E 3.0 x4 and SATA Form Factor: 2280, 22110 Key: M-Key Double Height Connector
Hot-swap: 45 Hot-swap 3.5″ SAS3/SATA3 drive bays 2 Rear Hot-swap 2.5″ SATA3 drive bays
Optional: 2 Hot-swap 2.5″ NVMe/SATA drive bays (rear)
Fans: 5 High-performance 80mm cooling fans
Total Output Power: 1000W: 100 – 127Vac 1600W: 200 – 240Vac
Dimension(W x H x L): 73.5 x 40 x 265 mm
Input: 100-127Vac / 12.9A Max / 50-60Hz 200-240Vac / 9.5A Max / 50-60Hz
+12V: Max: 82A / Min: 0.1A (100-127Vac) Max: 132A / Min: 0.1A (200-240Vac)
+5Vsb: Max: 2A / Min: 0.2A
Output Type: 25 Pairs Gold Finger Connector
Certification: Platinum Level [ Test Report ]
RoHS: RoHS Compliant
Environmental Spec.: Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)Non-operating Temperature: -40°C to 70°C (-40°F to 158°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing)
— Backup Storage, Cold Storage
— Database Applications
— Data Warehousing, Archiving
Key Features
1. Single Socket P (LGA 3647) supports
2nd Gen Intel® Xeon® Scalable
processor (Cascade Lake/Skylake)
2. 8 DIMMs’ up to 2TB 3DS ECC
DDR4-2933MHz RDIMM/LRDIMM
3. 2 PCI-E 3.0 x8 (in x16),
3 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8)
1 PCI-E 3.0 x8 (occupied by HBA)
4. 2 GbE LAN ports via Intel i210
5. 45 Hot-swap 3.5″ SAS3/SATA3 drive
bays, 2 rear Hot-swap 2.5″ SATA
drive bays’ optional 2 rear
Hot-swap 2.5″ SATA3/NVMe
6. Broadcom 3108 SAS3, HW RAID
(AOC-S3108L-H8IR-P )
7. Server remote management: IPMI 2.0
/ KVM over LAN / Media over LAN
8. 5 Hot-swap 8cm redundant PWM fans
9. 1600W Redundant Power Supplies
Platinum Level
Part Number | Qty | Description |
MCP-220-82616-0N | 1 | Rear hot-swap 2x 2.5" SATA drive kit |
BTR-CV3108-U1 | 1 | Broadcom 3108 CacheVault kit |
AOC-SGP-i2
|
-
|
Standard LP, 2x GbE RJ45, PCI-E x4, Intel i350-AM2
|
MCP-220-82619-0N
|
1
|
Rear hot-swap 2.5" x2 NVMe drive kit
|
AOM-TPM-9670V
|
1
|
TPM 2.0, vertical form factor
|
OS4HR3/2/1 OSNBD3/2/1 |
-
|
3/2/1-year onsite 24x7x4 service
|
SFT-OOB-LIC
|
1 | OOB Management Package (per node license) |
SFT-DCMS-Single |
1 | DataCenter Management Package (per node license) |