AS -2113S-WN24RT: A+ Server 2113S-WN24RT
CPU: Single AMD EPYC™ 7001/7002* series Processor (*Board revision 2.x required) Socket SP3 Supports CPU TDP 225W / cTDP up to 240W*
Cores: Up to 32 Cores (Board revision 1.x + 7001 Processors) Up to 64 Cores (Board revision 2.x + 7002 Processors)
Chipset: System on Chip (SoC)
Memory Capacity: 16 DIMM slots Supports up to 2TB Registered ECC DDR4 2666MHz SDRAM (7001 Processors) Supports up to 4TB Registered ECC DDR4 3200MHz SDRAM (Board revision 2.x required + 7002 Processors) 8-channel memory bus
Memory Type: DDR4 2666 MHz Registered ECC, 288-pin gold-plated DIMMs (7001 Processors) DDR4 3200 MHz Registered ECC, 288-pin gold-plated DIMMs (Board revision 2.x required + 7002 Processors)
DIMM Sizes: 4GB, 8GB, 16GB, 32GB, 64GB, 128GB, 256GB*(* Board revision 2.x required + 7002 Processors)
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errors Detects double-bit errors (using ECC memory)
IPMI: Support for Intelligent Platform Management Interface v.2.0 IPMI 2.0 with virtual media over LAN and KVM-over-LAN support ASPEED AST2500 BMC
Network Controllers: Broadcom BCM57416 Controller
VGA: ASPEED AST2500 BMC
PCI Express: 1 PCI-E 3.0 x16 (FH/HL) slot
M.2: Interface: PCI-E 3.0 x2 (NVMe based) Form Factor: 2280, 22110 Key: Onboard M-key Number of M.2: Dual
NVMe: Up to 24 U.2 NVMe support
LAN: 2x 10GbBase-T LAN ports 1 RJ45 Dedicated IPMI LAN port
USB: 5 USB 3.0 ports (4 rear + 1 Type A)
VGA: 1 VGA port
Others: 1 COM port 2 SATA DOM power connectorsTPM 1.2 header
BIOS Type: AMI 128Mb SPI Flash EEPROM
BIOS Features: Plug and Play (PnP) DMI 2.3 PCI 2.2 ACPI 5.1 USB Keyboard Support SMBIOS 3.1.1
Form Factor: 2U
Model: CSE-216BTS-R1K23WBP
Height: 3.5″ (89mm)
Width: 17.2″ (437mm)
Depth: 24.8″ (630mm)
Package: 10.1″ (H) 25.8″ (W) 37.8″ (D)
Weight: Net Weight: 34 lbs (15.42 kg) Gross Weight: 59 lbs (26.76 kg)
Buttons: Power On/Off button System Reset button
LEDs: Power LED Hard drive activity LED 2x Network activity LEDs System Overheat LED / Fan fail LED / UID LED
Hot-swap: 24 hot-swap 2.5″ U.2 NVMe drive bays
Fans: 3 heavy-duty PWM fans with optimal fan speed control
Air Shroud: 1 Air Shroud
Total Output Power: 1000W/1200W
Dimension(W x H x L): 76 x 40 x 336 mm
Input: 100-127Vac / 15-12A / 50-60Hz 200-240Vac / 8.5-7A / 50-60Hz 200-240Vdc / 8.5-7A (for CCC only)
+12V: Max: 83A / Min: 0A (100-127Vac) Max: 100A / Min: 0A (200-240Vac) Max: 100A / Min: 0A (200-240Vdc)
+5Vsb: Max: 4A / Min: 0A
Output Type: 19 Pairs Gold Finger Connector
Certification: Titanium Level [ Test Report ]
CPU: Monitors CPU Core Voltages, +1.8V, +3.3V, +5V, +5V standby, 3.3V standby, VBAT CPU switching voltage regulator
FAN: Up to 6-fan status tachometer monitoringUp to six 4-pin fan headersStatus monitor for speed control Pulse Width Modulated (PWM) fan connectors
Temperature: Monitoring for CPU and chassis environment CPU Thermal Trip Support Thermal control for 6x Fan connectors I²C Temperature Sensing Logic
LED: CPU / System Overheat LED
Other Features: Chassis Intrusion Detection Chassis Intrusion Header
RoHS: RoHS Compliant
Environmental Spec.: Operating Temperature: 10°C to 35°C (50°F to 95°F)Non-operating Temperature:-40°C to 70°C (-40°F to 158°F)Operating Relative Humidity:8% to 90% (non-condensing)Non-operating Relative Humidity:5% to 95% (non-condensing)
Virtualization
Hyperconverged Storage
Cloud Computing
All Flash Storage
1. Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x)
2. 2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs
4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs (Board revision 2.x required)
3. Expansion slots:
1 PCI-E 3.0 x16 (FH/HL) slot
M.2 Interface: PCI-E 3.0 x2 (NVMe based)
M.2 Form Factor: 2280, 22110
M.2 Key: Onboard M-key
Number of M.2: Dual
4. Integrated IPMI 2.0 + KVM with dedicated LAN
• Software Out of Band License
key (SFT-OOB-LIC) included
for OOB BIOS management
5. 2x 10GBase-T LAN ports via Broadcom BCM57416
6. 24 hot-swap 2.5″ U.2 NVMe drive bays
7. 1200W Redundant Power Supplies
Titanium Level (96%)
(Full redundancy based on configuration and application load)
Part Number | Qty | Description |
MCP-220-82616-0N | 1 | 12G 2.5x2 Drive Kit w/ Status LED(216B/826B/417B/846X/847B) |
MCP-290-00073-0N
|
- |
Supermicro Cable Management Arm for 2U, 3U and 4U chassis
|
AOM-TPM-9655V | - | Vertical TPM with Infineon 9655 TCG 1.2 |
AOM-TPM-9665V | - | AOM-TPM-9665V using SLB9665 Chipset supporing TPM2.0,RoHS/REACH |
OS4HR3/2/1 |
- | 3/2/1-year onsite 24x7x4 service |
OSNBD3/2/1 |
- | 3/2/1-year onsite NBD service |
SFT-DCMS-Single |
1 | DataCenter Management Package (per node license) |