Form Factor: Proprietary
Dimension: 17″ x 10.7″ (43.18cm x 27.18cm)
CPU: 3rd Gen Intel® Xeon® Scalable processors Dual Socket Socket P+ (LGA-4189) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
Core: Up to 40 cores
Memory Capacity: 32 DIMM slots Up to 8TBIntel® Optane™ Persistent Memory 200 Series, DDR4-3200MT/s Up to 8TB 3DSECC LRDIMM, DDR4-3200MT/s’ Up to 8TB 3DSECC RDIMM, DDR4-3200MT/s
Memory Type: ECC DDR4 LRDIMM (3DS), RDIMM (3DS)
DIMM Sizes: LRDIMM: 16GB, 32GB, 64GB, 128GB, 256GB RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
Memory Voltage: 1.2V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: Intel® C621A
SATA: Intel® C621A controller for 8 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2600 BMC
Graphics: 1 ASPEED AST2600 BMC port(s)
Network Controllers: N/A
LAN: 1 RJ45 Dedicated IPMI LAN port
USB: 4 USB 3.2 Gen1 port(s) (4 via header)
Video Output: 1 VGA D-Sub Connector port(s)
Serial Port: 1 COMPort(s) (1 header)
TPM: 1 TPM Header
PCIe: 1 PCIe 4.0 x16, AIOM (OCP3.0 Compliant),5 PCIe 4.0 x16
M.2: M.2 Interface: 2 SATA/PCIe 3.0 x2, RAID 0 & 1 Form Factor: 2280/22110
BIOS Type: AMI UEFI
Software: Redfish API, Supermicro Server Manager (SSM), Supermicro Power Manager (SPM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), KVM with dedicated LAN , IPMI 2.0
Hardware: Trusted Platform Module (TPM) 2.0
Voltage: PCH temperature, Monitors CPU voltages, Memory temperature, CPU temperature, Chassis intrusion header, 3.3V standby, +5V standby, +12V, VRM temperature, Monitors for CPU Cores, Memory Voltages, 10 -fan status, +1.8V PCH
LED: UID/Remote UID BMC/IPMI Heartbeat LED
FAN: 10x 6-pin fan headers (up to 10 fans) 10x fans with tachometer monitoring
Other Features: WOL, UID, Node Manager Support, CPU thermal trip support for processor protection, Control of power-on for recovery from AC power loss, Chassis intrusion header, Chassis intrusion detection, ACPI power management, RoT, RoHS, Halogen Free, NCSI header
Operating Temperature Range: 10°C — 35°C (50°F — 95°F)
Non-Operating Temperature Range: -40°C — 70°C (-40°F — 158°F)
Operating Relative Humidity Range: 8% — 90% (non-condensing)
Non Operating Relative Humidity Range: 5% — 95% (non-condensing)
Key Features
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- 3rd Gen Intel® Xeon® Scalable processors
- Dual Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP, 3 UPI up to 11.2 GT/s
- Intel® C621A
-
- Up to 8TB 3DS ECC RDIMM, DDR4-3200MHz’ Up to 8TB 3DS ECC LRDIMM, DDR4-3200MHz
- Up to 8TB Intel® Optane™ Persistent Memory, DDR4-3200MHz, in 32 DIMM slots
-
- 5 PCIe 4.0 x16,
- 8 PCIe 4.0 NVMe x4
- M.2 Interface: 2 SATA/PCIe 3.0 x2, RAID 0 &’ 1
- M.2 Form Factor: 2280/22110
- 1 PCIe 4.0 x16, AIOM (OCP3.0 Compliant)
- Intel® C621A controller for 8 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
- 1 VGA D-Sub Connector port
Optimized Servers
SYS-120H-TNRSYS-220HE-FTNRSYS-220HE-FTNRDSYS-620H-TN12RSYS-220H-TN24RSYS-220HE-FTNR-NEBSSYS-220HE-FTNRD-NEBSSYS-220HE-TNRSYS-220HE-TNRD
Part Number | Qty | Description |
AOM-TPM-9670V
AOM-TPM-9670H |
1
1 |
SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor
SPI capable TPM 2.0 with Infineon 9670 controller with horizontal form factor |