Form Factor: Proprietary GrandTwin
Dimension: 8.53″ x 12.42″ (21.67cm x 31.55cm)
CPU: 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors Single Socket Socket E (LGA-4677) supported, CPU TDP supports Up to 350W TDP *BIOS 2.1 or above is required to support 5th Gen Intel® Xeon® Scalable processors
Core: Up to 64 cores
Memory Capacity: 16 DIMM slots Up to 4TB 3DSECC RDIMM, DDR5-5600MT/s **24GB & 48GB DIMM only support 1 DPC. *24GB/48GB/96GB DDR5 DIMMs with 24Gb chip are only supported by 5th and 4th XCC Gen Intel® Xeon-SP CPU.
Memory Type: 5600/5200/4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS)Up to 256GB of memory with speeds of up to 4400MT/s (2DPC)
DIMM Sizes: 16GB, 24GB,32GB, 48GB,64GB, 96GB, 128GB, 256GB
Memory Voltage: 1.1V
Error Detection: Corrects single-bit errors
Chipset: Intel® C741
SATA: Intel® C741 controller for 6 SATA3 (6 Gbps) ports’ RAID 0,1,5,10
IPMI: ASPEED AST2600 BMC
Network Controllers: AIOM for LAN
SATA: 6 SATA3 (6Gbps) port(s)
Serial Port: 1 COMPort(s) (1 header)
TPM: 1 TPM Header
PCIe: N/A
M.2: M.2 Interface: 2 SATA/PCIe 3.0 x4 Form Factor: 2280 Key: M-Key
BIOS Type: AMI UEFI
BIOS Features: ACPI 6.4SMBIOS 3.5UEFI 2.8 or above
Software: Redfish API, Supermicro Server Manager (SSM), Supermicro Power Manager (SPM), Supermicro Update Manager (SUM), Supermicro SuperDoctor® 5 (SD5), Super Diagnostics Offline (SDO), KVM with dedicated LAN , IPMI 2.0
Hardware: Trusted Platform Module (TPM) 2.0
Voltage: VBAT, System level control, Supports system management utility, Monitors CPU voltages, Chipset Voltage, +5V standby, +5V, +3.3V, +12V
LED: UID/Remote UID CPU / System Overheat LED
Temperature: Monitoring for CPU and chassis environment CPU thermal trip support Thermal Monitor 2 (TM2) support PECI
FAN: 1x 4-pinfan header (up to 1 fan) Fan speed control
Other Features: WOL, UID, Node Manager Support, M.2 NGFF connector, Control of power-on for recovery from AC power loss, ACPI power management
X13SET-G
Key Features
- 5th/4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
- Intel C741® Chipset
- Up to 4TB 3DS ECC RDIMM, DDR5-5600MT/s (1DPC) or DDR5-4400MT/s (2DPC) in 16 DIMM slots
- 1 PCIe 5.0 x8 via customized 124-pin slim cool edge connector(for front I/O module)
- 2 PCIe 5.0 x16 via Molex Impleplus connectors
- 4 PCIe 5.0 X8 via MCIO connectors
- I/O: 1 COM, TPM header
- M.2 Interface: 2 PCIe 3.0×4&’SATAM.2 Form Factor: 2280M.2 Key: M-Key
Optimized Servers
SYS-211GT-HNTFSYS-211GT-HNTR
| Part Number | Qty | Description |
| AOM-TPM-9670V | 1 | SPI capable TPM 2.0 with Infineon 9670 controller with vertical form factor |