Form Factor: Proprietary
Dimension: 13″ x 12.89″ (33.02cm x 32.74cm)
CPU: Intel® Xeon® 6700E-series Single Socket E2 (LGA-4710) supported, CPU TDP supports Up to 350W TDP
Core: Up to 144 (E) cores
Memory Capacity: 16 DIMM slots Up to 1TB ECC Registered RDIMM, DDR5-6400MT/s *Only 64GB with 16Gb chip supports 2 DPC
Memory Type: 6400 MT/s ECC DDR5 RDIMMUp to 128GB of memory with speeds of up to 6400 MT/s(1DPC) or 5200 MT/s (2DPC)
DIMM Sizes: 32GB, 64GB, 128GB
Memory Voltage: 1.1V
Error Detection: Corrects single-bit errorsDetects double-bit errors (using ECC memory)
Chipset: System on Chip
IPMI: ASPEED AST2600 BMC
Network Controllers: AIOM for LAN
LAN: 1 AIOM
USB: 2 USB 3.2 Gen1 port(s) (2 via header)
TPM: 1 TPM Header 1 TPM TPM 2.0 onboard
PCIe: 1 PCIe 5.0 x16 AIOM,2 PCIe 5.0 x16 4C slots,10 PCIe 5.0 x8 MCIO connector
M.2: M.2 Interface: 2 PCIe 5.0 x2 Form Factor: 2280/22110/25110 Key: M-Key
BIOS Type: AMI 64MB AMI UEFI
BIOS Features: ACPI 6.5SMBIOS 3.7 or laterUEFI 2.9
Voltage: VBAT, System level control, Supports system management utility, Monitors CPU voltages, +5V standby, +5V, +3.3V, +12V
LED: UID/Remote UID CPU / System Overheat LED
Temperature: Monitoring for CPU and chassis environment CPU thermal trip support Thermal Monitor 2 (TM2) support PECI
FAN: 10x 4-pin fan headers (up to 10 fans) Fan speed control
Other Features: UID M.2 NGFF connector Control of power-on for recovery from AC power loss Chassis intrusion detection ACPI power management
Key Features
- Intel® Xeon® 6700E-series, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP
- Up to 1TB ECC RDIMM, DDR5-6400MT/s (1DPC) or DDR5-5200MT/s (2DPC) in 16 DIMM slots
- 10 PCIe 5.0 x8 via MCIO connectors
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- 2 PCIe 5.0 x16 4C
- 1 PCIe 5.0 x16 AIOM
- M.2 Interface: 2 PCIe 5.0 x2
- M.2 Form Factor: 2280, 22110, 25110
- M.2 Key: M-Key
- AIOM for LAN
- Onboard TPM2.0
Optimized Servers
SYS-112H-TNSYS-212H-TN
Part Number | Qty | Description |
AOM-TPM-9672V |
1 | SPIcapable TPM 2.0 with Infineon 9672 controller with vertical form factor |